JPS5599769A - Semicondcutor device - Google Patents

Semicondcutor device

Info

Publication number
JPS5599769A
JPS5599769A JP798279A JP798279A JPS5599769A JP S5599769 A JPS5599769 A JP S5599769A JP 798279 A JP798279 A JP 798279A JP 798279 A JP798279 A JP 798279A JP S5599769 A JPS5599769 A JP S5599769A
Authority
JP
Japan
Prior art keywords
film
metal
area
bonding pad
removal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP798279A
Other languages
Japanese (ja)
Other versions
JPS6346573B2 (en
Inventor
Sazuku Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP798279A priority Critical patent/JPS5599769A/en
Publication of JPS5599769A publication Critical patent/JPS5599769A/en
Publication of JPS6346573B2 publication Critical patent/JPS6346573B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase yields, by forming part or the entire area of a bonding pad to be 10μm or more wide from the insulation film removal line formed on the bonding pad.
CONSTITUTION: Metal film 2 formed on insulation oxide film 3 on semiconductor substrate 4 is anode-oxidized, and the metal region, except for the wiring part, and the upper surface of the metal film of the wiring part are converted into metal oxide film 1. Bonding pad (BP) 2 is provided in the metal wiring for connecting to an external electrode or for inspection of the characteristics, but the area of film 1 on BP to be removed is left as it is. When the area of BP is widened to d2, even if the position of the metal probe comes near the film removal line on BP, since wall 8 on the boundary between BP and the film is far away, the pressure of the probe onto insulating oxide film 3 of BP is weak, so that the probe slides sideway but does not cause a crack. For determining the size in expanding the area of BP, distance d2 from the insulating film removal line on BP is set at 10μm or more.
COPYRIGHT: (C)1980,JPO&Japio
JP798279A 1979-01-25 1979-01-25 Semicondcutor device Granted JPS5599769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP798279A JPS5599769A (en) 1979-01-25 1979-01-25 Semicondcutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP798279A JPS5599769A (en) 1979-01-25 1979-01-25 Semicondcutor device

Publications (2)

Publication Number Publication Date
JPS5599769A true JPS5599769A (en) 1980-07-30
JPS6346573B2 JPS6346573B2 (en) 1988-09-16

Family

ID=11680637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP798279A Granted JPS5599769A (en) 1979-01-25 1979-01-25 Semicondcutor device

Country Status (1)

Country Link
JP (1) JPS5599769A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4870475A (en) * 1971-12-23 1973-09-25
JPS5353969U (en) * 1976-10-08 1978-05-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4870475A (en) * 1971-12-23 1973-09-25
JPS5353969U (en) * 1976-10-08 1978-05-09

Also Published As

Publication number Publication date
JPS6346573B2 (en) 1988-09-16

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