JPS5599719A - Heat treatment jig of wafer - Google Patents

Heat treatment jig of wafer

Info

Publication number
JPS5599719A
JPS5599719A JP710179A JP710179A JPS5599719A JP S5599719 A JPS5599719 A JP S5599719A JP 710179 A JP710179 A JP 710179A JP 710179 A JP710179 A JP 710179A JP S5599719 A JPS5599719 A JP S5599719A
Authority
JP
Japan
Prior art keywords
wafer
heat treatment
support
supporting members
shape grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP710179A
Other languages
Japanese (ja)
Inventor
Noboru Tatefuru
Koichi Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP710179A priority Critical patent/JPS5599719A/en
Publication of JPS5599719A publication Critical patent/JPS5599719A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE: To support wafers stably without damaging them in a wafer supporting jig for wafer heat treatment for the production of semiconductor devices by arranging supporting members so that V shape grooves may come to positions to support a wafer by four bisymmetrical points not higher than its center at the highest.
CONSTITUTION: Bar shape supporting members 2a, 2b, 2c and 2d on which V shape grooves 1a, 1b ... are formed at prescribed intervals are connected with connecting members 3a, 3b ... arranging and fixing the supporting members so that the V shape grooves may come to positions to support a wafer 4 by four points A, B, C and D which are lower than its center 0 at the highest and are symmetrical with respect to line Y-Y which passes point 0.
COPYRIGHT: (C)1980,JPO&Japio
JP710179A 1979-01-26 1979-01-26 Heat treatment jig of wafer Pending JPS5599719A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP710179A JPS5599719A (en) 1979-01-26 1979-01-26 Heat treatment jig of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP710179A JPS5599719A (en) 1979-01-26 1979-01-26 Heat treatment jig of wafer

Publications (1)

Publication Number Publication Date
JPS5599719A true JPS5599719A (en) 1980-07-30

Family

ID=11656683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP710179A Pending JPS5599719A (en) 1979-01-26 1979-01-26 Heat treatment jig of wafer

Country Status (1)

Country Link
JP (1) JPS5599719A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138142A (en) * 1981-01-14 1982-08-26 Northern Telecom Ltd Method and device for coating semiconductor wafer
JPS61171242U (en) * 1985-04-11 1986-10-24
JPS61190128U (en) * 1985-05-20 1986-11-27
JPH02142633U (en) * 1989-05-08 1990-12-04
JP2003047811A (en) * 2001-08-08 2003-02-18 Toyobo Co Ltd Electret filter medium and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037355A (en) * 1973-08-06 1975-04-08
JPS5164867A (en) * 1974-12-03 1976-06-04 Tokyo Shibaura Electric Co Handotaisochino seizosochi

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037355A (en) * 1973-08-06 1975-04-08
JPS5164867A (en) * 1974-12-03 1976-06-04 Tokyo Shibaura Electric Co Handotaisochino seizosochi

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138142A (en) * 1981-01-14 1982-08-26 Northern Telecom Ltd Method and device for coating semiconductor wafer
JPS61171242U (en) * 1985-04-11 1986-10-24
JPS61190128U (en) * 1985-05-20 1986-11-27
JPH02142633U (en) * 1989-05-08 1990-12-04
JP2003047811A (en) * 2001-08-08 2003-02-18 Toyobo Co Ltd Electret filter medium and method for manufacturing the same

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