JPS55774A - Electrically conductive adhesive part and its use - Google Patents

Electrically conductive adhesive part and its use

Info

Publication number
JPS55774A
JPS55774A JP5365379A JP5365379A JPS55774A JP S55774 A JPS55774 A JP S55774A JP 5365379 A JP5365379 A JP 5365379A JP 5365379 A JP5365379 A JP 5365379A JP S55774 A JPS55774 A JP S55774A
Authority
JP
Japan
Prior art keywords
conductors
terminals
electrically conductive
conductive
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5365379A
Other languages
Japanese (ja)
Inventor
Masanori Fujita
Yoshinori Suzuki
Teruo Takane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP5365379A priority Critical patent/JPS55774A/en
Publication of JPS55774A publication Critical patent/JPS55774A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE: Electrically conductive particles and a thermoplastic resin are mixed in such a proportion that the compound becomes conductive only in the direction pressed and the compound is made into sheets, which facilitate the adhesion of groups of connecting termials oppositing to each other in fine pitch.
CONSTITUTION: Electrically conductive particles are mixed with a pasty thermoplastic resin in such a proportion that the compound shows insulating properties in any direction when cured without pressing but it becomes conductive only in the direction pressed when cured with pressing. The mixture is made into sheets ro prepare the conductive adhesive part 6. Conductors 10 .... corresponding to termials 9 .... of itegrated circuit 7 are wired by printing. First, conductive adhesive sheet 6 is placed on the base plate 8 and terminals 9 ... are set thereon and made to coincide with conductors 10 ...., then the adhesive sheet 6 is melted and terminals 9 ... are pressed to conductors 10 .... by heating. After that, heating is stopped and sheet 6 is solidified. Terminals 9 ... are mechanically connected with conductors 10 ... and simultaneously only parts between oppositing terminals 9 ... and conductors 10 ... become conductive.
COPYRIGHT: (C)1980,JPO&Japio
JP5365379A 1979-05-01 1979-05-01 Electrically conductive adhesive part and its use Pending JPS55774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5365379A JPS55774A (en) 1979-05-01 1979-05-01 Electrically conductive adhesive part and its use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5365379A JPS55774A (en) 1979-05-01 1979-05-01 Electrically conductive adhesive part and its use

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11851575A Division JPS5241648A (en) 1975-09-30 1975-09-30 Conductive adhesives

Publications (1)

Publication Number Publication Date
JPS55774A true JPS55774A (en) 1980-01-07

Family

ID=12948824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5365379A Pending JPS55774A (en) 1979-05-01 1979-05-01 Electrically conductive adhesive part and its use

Country Status (1)

Country Link
JP (1) JPS55774A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984962A (en) * 1982-11-08 1984-05-16 Oyo Jiki Kenkyusho:Kk Electrically conductive hot-melt adhesive
JPS59141286A (en) * 1983-02-01 1984-08-13 株式会社精工舎 Circuit board
JPS60133054A (en) * 1983-12-05 1985-07-16 Nippon Kokuen Kogyo Kk Composition for conductively anisotropic heat sealing, its manufacture and its usage
JPS6241277A (en) * 1985-08-16 1987-02-23 Shin Etsu Polymer Co Ltd Anisotropically conductive adhesive
US4645365A (en) * 1984-01-25 1987-02-24 Sharp Kabushiki Kaisha Paper feed control in a printer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109936A (en) * 1975-03-25 1976-09-29 Suwa Seikosha Kk Dodenihoseiomotsu setsuchakuzai
JPS51119732A (en) * 1975-04-15 1976-10-20 Seiko Epson Corp Adhesive with anisotropy in the direction of conducting path
JPS51135938A (en) * 1975-05-21 1976-11-25 Seiko Epson Corp Anisotropic electroconductive adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109936A (en) * 1975-03-25 1976-09-29 Suwa Seikosha Kk Dodenihoseiomotsu setsuchakuzai
JPS51119732A (en) * 1975-04-15 1976-10-20 Seiko Epson Corp Adhesive with anisotropy in the direction of conducting path
JPS51135938A (en) * 1975-05-21 1976-11-25 Seiko Epson Corp Anisotropic electroconductive adhesive

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984962A (en) * 1982-11-08 1984-05-16 Oyo Jiki Kenkyusho:Kk Electrically conductive hot-melt adhesive
JPS59141286A (en) * 1983-02-01 1984-08-13 株式会社精工舎 Circuit board
JPS60133054A (en) * 1983-12-05 1985-07-16 Nippon Kokuen Kogyo Kk Composition for conductively anisotropic heat sealing, its manufacture and its usage
JPS619342B2 (en) * 1983-12-05 1986-03-22 Nippon Kokuen Kogyo Kk
US4645365A (en) * 1984-01-25 1987-02-24 Sharp Kabushiki Kaisha Paper feed control in a printer
JPS6241277A (en) * 1985-08-16 1987-02-23 Shin Etsu Polymer Co Ltd Anisotropically conductive adhesive
JPH0410916B2 (en) * 1985-08-16 1992-02-26

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