JPS5572040A - Method for pattern formation - Google Patents
Method for pattern formationInfo
- Publication number
- JPS5572040A JPS5572040A JP14749578A JP14749578A JPS5572040A JP S5572040 A JPS5572040 A JP S5572040A JP 14749578 A JP14749578 A JP 14749578A JP 14749578 A JP14749578 A JP 14749578A JP S5572040 A JPS5572040 A JP S5572040A
- Authority
- JP
- Japan
- Prior art keywords
- etched
- sent
- etching
- cassette
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form a fine pattern by switching a dry etching to a wet etching on the way.
CONSTITUTION: An object 3 to be etched, which is holding in a cassette 20, is sent into a room 11 facing up the surface of object 3b on which a patterning is made by a regist film 3c and contacting the base 3a on the conveyor 19, and it is etched first by gas plasma. Further it is sent to a next room 16 in a state of some material 3b being lefted in the around of pattern. After it was cooled, it is etched by etching solution which is sprayed from jet nozzles 18 when it passes the place, and then it is sent to the cassette 21. A fine etching is obtained by this constitution using advantages of dry and wet etchings.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14749578A JPS5572040A (en) | 1978-11-25 | 1978-11-25 | Method for pattern formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14749578A JPS5572040A (en) | 1978-11-25 | 1978-11-25 | Method for pattern formation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572040A true JPS5572040A (en) | 1980-05-30 |
Family
ID=15431670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14749578A Pending JPS5572040A (en) | 1978-11-25 | 1978-11-25 | Method for pattern formation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572040A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992007376A1 (en) * | 1990-10-19 | 1992-04-30 | Integrated Process Equipment Corporation | Semiconductor processing apparatus and method |
US5135608A (en) * | 1989-07-11 | 1992-08-04 | Hitachi, Ltd. | Method of producing semiconductor devices |
US5200017A (en) * | 1989-02-27 | 1993-04-06 | Hitachi, Ltd. | Sample processing method and apparatus |
EP0751552A1 (en) * | 1989-02-27 | 1997-01-02 | Hitachi, Ltd. | Sample processing apparatus |
US6036816A (en) * | 1989-02-27 | 2000-03-14 | Hitachi, Ltd. | Apparatus for processing a sample having a metal laminate |
-
1978
- 1978-11-25 JP JP14749578A patent/JPS5572040A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5200017A (en) * | 1989-02-27 | 1993-04-06 | Hitachi, Ltd. | Sample processing method and apparatus |
EP0751552A1 (en) * | 1989-02-27 | 1997-01-02 | Hitachi, Ltd. | Sample processing apparatus |
US6036816A (en) * | 1989-02-27 | 2000-03-14 | Hitachi, Ltd. | Apparatus for processing a sample having a metal laminate |
US6254721B1 (en) | 1989-02-27 | 2001-07-03 | Hitachi, Ltd. | Method and apparatus for processing samples |
US6537417B2 (en) | 1989-02-27 | 2003-03-25 | Hitachi, Ltd. | Apparatus for processing samples |
US6537415B2 (en) | 1989-02-27 | 2003-03-25 | Hitachi, Ltd. | Apparatus for processing samples |
US6656846B2 (en) | 1989-02-27 | 2003-12-02 | Hitachi, Ltd. | Apparatus for processing samples |
US5135608A (en) * | 1989-07-11 | 1992-08-04 | Hitachi, Ltd. | Method of producing semiconductor devices |
WO1992007376A1 (en) * | 1990-10-19 | 1992-04-30 | Integrated Process Equipment Corporation | Semiconductor processing apparatus and method |
US5227001A (en) * | 1990-10-19 | 1993-07-13 | Integrated Process Equipment Corporation | Integrated dry-wet semiconductor layer removal apparatus and method |
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