JPS5571031A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5571031A
JPS5571031A JP14419778A JP14419778A JPS5571031A JP S5571031 A JPS5571031 A JP S5571031A JP 14419778 A JP14419778 A JP 14419778A JP 14419778 A JP14419778 A JP 14419778A JP S5571031 A JPS5571031 A JP S5571031A
Authority
JP
Japan
Prior art keywords
wire
pellet
lead
hollows
neighborhood
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14419778A
Other languages
Japanese (ja)
Inventor
Usuke Enomoto
Haruo Kugimiya
Yasuo Taira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14419778A priority Critical patent/JPS5571031A/en
Publication of JPS5571031A publication Critical patent/JPS5571031A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent a wire from involving faults through contact and thus to improve a yield by an arrangement wherein a hollow is formed in the neighborhood of the inner end of a lead and a bonded wire is retained at a stepped part of the lead hollow to have its direction toward an electrode of a pellet specified accordingly.
CONSTITUTION: Hollows 10, 11 are formed in the neighborhood of the inner ends of leads 1, 2 in a lead frame, and bonded wires 5, 6 are retained at a stepped part of said hollows, thereby specifying the wire direction toward an electrode of a pellet 4 on a tab 3. The wire to run in the pellet direction is held up consequently, and thus a short-circuit fault to arise from the wire coming in contact with the tab (collector lead) on the pellet can be prevented effectively.
COPYRIGHT: (C)1980,JPO&Japio
JP14419778A 1978-11-24 1978-11-24 Semiconductor device Pending JPS5571031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14419778A JPS5571031A (en) 1978-11-24 1978-11-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14419778A JPS5571031A (en) 1978-11-24 1978-11-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5571031A true JPS5571031A (en) 1980-05-28

Family

ID=15356462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14419778A Pending JPS5571031A (en) 1978-11-24 1978-11-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5571031A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030075788A (en) * 2002-03-20 2003-09-26 세미웰반도체 주식회사 A Semiconductor Package Structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5197974A (en) * 1975-02-26 1976-08-28
JPS527562B2 (en) * 1973-06-04 1977-03-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527562B2 (en) * 1973-06-04 1977-03-03
JPS5197974A (en) * 1975-02-26 1976-08-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030075788A (en) * 2002-03-20 2003-09-26 세미웰반도체 주식회사 A Semiconductor Package Structure

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