JPS5545505A - Solderable aluminum material - Google Patents

Solderable aluminum material

Info

Publication number
JPS5545505A
JPS5545505A JP11665378A JP11665378A JPS5545505A JP S5545505 A JPS5545505 A JP S5545505A JP 11665378 A JP11665378 A JP 11665378A JP 11665378 A JP11665378 A JP 11665378A JP S5545505 A JPS5545505 A JP S5545505A
Authority
JP
Japan
Prior art keywords
film
easy
fine pores
aluminum material
solder metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11665378A
Other languages
Japanese (ja)
Inventor
Akiyoshi Yasumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP11665378A priority Critical patent/JPS5545505A/en
Publication of JPS5545505A publication Critical patent/JPS5545505A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To fill and deposit easy-to-solder metal in fine pores in such a manner as to build up by forming the anodized film having perpendicular fine pores in aluminum blank.
CONSTITUTION: An anodized film 2 is formed on an aluminum blank 1. Next, easy-to-solder metal 4 is deposited and filled in the perpendicular fine pores of the film 2 so as to build up in the upper part or the easy-to-solder metal 4 is deposited so as to cover the film 2. In this way, ordinary soldering work is applied.
COPYRIGHT: (C)1980,JPO&Japio
JP11665378A 1978-09-25 1978-09-25 Solderable aluminum material Pending JPS5545505A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11665378A JPS5545505A (en) 1978-09-25 1978-09-25 Solderable aluminum material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11665378A JPS5545505A (en) 1978-09-25 1978-09-25 Solderable aluminum material

Publications (1)

Publication Number Publication Date
JPS5545505A true JPS5545505A (en) 1980-03-31

Family

ID=14692549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11665378A Pending JPS5545505A (en) 1978-09-25 1978-09-25 Solderable aluminum material

Country Status (1)

Country Link
JP (1) JPS5545505A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945448B2 (en) * 2002-06-18 2005-09-20 Zimmer Technology, Inc. Method for attaching a porous metal layer to a metal substrate
JP2011212684A (en) * 2010-03-31 2011-10-27 Hitachi Ltd Metal bonding member and fabrication method of the same
US8191760B2 (en) 2002-06-18 2012-06-05 Zimmer Technology, Inc. Method for attaching porous metal layer to a metal substrate
JP2015073993A (en) * 2013-10-04 2015-04-20 株式会社Uacj Soldering method of aluminium material
TWI641441B (en) * 2015-05-18 2018-11-21 日商拓自達電線股份有限公司 Solder connection structure and film forming method
US10926514B2 (en) 2015-12-24 2021-02-23 Tatsuta Electric Wire & Cable Co., Ltd. Solder connection structure and film forming method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945448B2 (en) * 2002-06-18 2005-09-20 Zimmer Technology, Inc. Method for attaching a porous metal layer to a metal substrate
US8191760B2 (en) 2002-06-18 2012-06-05 Zimmer Technology, Inc. Method for attaching porous metal layer to a metal substrate
US8985430B2 (en) 2002-06-18 2015-03-24 Zimmer, Inc. Method for attaching a porous metal layer to a metal substrate
US9656358B2 (en) 2002-06-18 2017-05-23 Zimmer, Inc. Method for attaching a porous metal layer to a metal substrate
JP2011212684A (en) * 2010-03-31 2011-10-27 Hitachi Ltd Metal bonding member and fabrication method of the same
JP2015073993A (en) * 2013-10-04 2015-04-20 株式会社Uacj Soldering method of aluminium material
TWI641441B (en) * 2015-05-18 2018-11-21 日商拓自達電線股份有限公司 Solder connection structure and film forming method
US10926514B2 (en) 2015-12-24 2021-02-23 Tatsuta Electric Wire & Cable Co., Ltd. Solder connection structure and film forming method

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