JPS5545505A - Solderable aluminum material - Google Patents
Solderable aluminum materialInfo
- Publication number
- JPS5545505A JPS5545505A JP11665378A JP11665378A JPS5545505A JP S5545505 A JPS5545505 A JP S5545505A JP 11665378 A JP11665378 A JP 11665378A JP 11665378 A JP11665378 A JP 11665378A JP S5545505 A JPS5545505 A JP S5545505A
- Authority
- JP
- Japan
- Prior art keywords
- film
- easy
- fine pores
- aluminum material
- solder metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To fill and deposit easy-to-solder metal in fine pores in such a manner as to build up by forming the anodized film having perpendicular fine pores in aluminum blank.
CONSTITUTION: An anodized film 2 is formed on an aluminum blank 1. Next, easy-to-solder metal 4 is deposited and filled in the perpendicular fine pores of the film 2 so as to build up in the upper part or the easy-to-solder metal 4 is deposited so as to cover the film 2. In this way, ordinary soldering work is applied.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11665378A JPS5545505A (en) | 1978-09-25 | 1978-09-25 | Solderable aluminum material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11665378A JPS5545505A (en) | 1978-09-25 | 1978-09-25 | Solderable aluminum material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5545505A true JPS5545505A (en) | 1980-03-31 |
Family
ID=14692549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11665378A Pending JPS5545505A (en) | 1978-09-25 | 1978-09-25 | Solderable aluminum material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5545505A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6945448B2 (en) * | 2002-06-18 | 2005-09-20 | Zimmer Technology, Inc. | Method for attaching a porous metal layer to a metal substrate |
JP2011212684A (en) * | 2010-03-31 | 2011-10-27 | Hitachi Ltd | Metal bonding member and fabrication method of the same |
US8191760B2 (en) | 2002-06-18 | 2012-06-05 | Zimmer Technology, Inc. | Method for attaching porous metal layer to a metal substrate |
JP2015073993A (en) * | 2013-10-04 | 2015-04-20 | 株式会社Uacj | Soldering method of aluminium material |
TWI641441B (en) * | 2015-05-18 | 2018-11-21 | 日商拓自達電線股份有限公司 | Solder connection structure and film forming method |
US10926514B2 (en) | 2015-12-24 | 2021-02-23 | Tatsuta Electric Wire & Cable Co., Ltd. | Solder connection structure and film forming method |
-
1978
- 1978-09-25 JP JP11665378A patent/JPS5545505A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6945448B2 (en) * | 2002-06-18 | 2005-09-20 | Zimmer Technology, Inc. | Method for attaching a porous metal layer to a metal substrate |
US8191760B2 (en) | 2002-06-18 | 2012-06-05 | Zimmer Technology, Inc. | Method for attaching porous metal layer to a metal substrate |
US8985430B2 (en) | 2002-06-18 | 2015-03-24 | Zimmer, Inc. | Method for attaching a porous metal layer to a metal substrate |
US9656358B2 (en) | 2002-06-18 | 2017-05-23 | Zimmer, Inc. | Method for attaching a porous metal layer to a metal substrate |
JP2011212684A (en) * | 2010-03-31 | 2011-10-27 | Hitachi Ltd | Metal bonding member and fabrication method of the same |
JP2015073993A (en) * | 2013-10-04 | 2015-04-20 | 株式会社Uacj | Soldering method of aluminium material |
TWI641441B (en) * | 2015-05-18 | 2018-11-21 | 日商拓自達電線股份有限公司 | Solder connection structure and film forming method |
US10926514B2 (en) | 2015-12-24 | 2021-02-23 | Tatsuta Electric Wire & Cable Co., Ltd. | Solder connection structure and film forming method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5545505A (en) | Solderable aluminum material | |
JPS5546558A (en) | Metallic cover plate for semiconductor package | |
JPS53105366A (en) | Manufacture for semiconductor element substrate | |
JPS51140565A (en) | Semiconductor unit | |
JPS5310266A (en) | Production of soldred semiconductor wafers | |
JPS51138733A (en) | Method of coatin g metals | |
JPS5426832A (en) | Coating method | |
JPS5391684A (en) | Semiconductor laser | |
JPS56129645A (en) | Forming method for metallic thin film | |
JPS52107600A (en) | Ferrite magnet | |
JPS5325481A (en) | Molten metal container | |
JPS527273A (en) | Binding method of watch parts | |
JPS52143764A (en) | Metal connecting method | |
JPS5226537A (en) | Surface treatment of aluminum and aluminum alloy | |
JPS53125444A (en) | Method of forming lustrous coating film | |
JPS51136063A (en) | Piston ring | |
JPS5224237A (en) | Coating layer containing metal foil | |
JPS53140334A (en) | Polyvinyl chloride type coating composition | |
JPS5396760A (en) | Case for semiconductor device and production of the same | |
JPS53120537A (en) | Roller | |
JPS52121043A (en) | Preparation of colored metal powder | |
JPS52146176A (en) | Formation of electrode in semiconductor device | |
JPS52156239A (en) | Noise preventive discharge electrode | |
JPS5213115A (en) | Fluid surface stabilizer | |
JPS5354988A (en) | Production of semiconductor device |