JPS5562762A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5562762A
JPS5562762A JP13548378A JP13548378A JPS5562762A JP S5562762 A JPS5562762 A JP S5562762A JP 13548378 A JP13548378 A JP 13548378A JP 13548378 A JP13548378 A JP 13548378A JP S5562762 A JPS5562762 A JP S5562762A
Authority
JP
Japan
Prior art keywords
layer
collector
transistor
emitter
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13548378A
Other languages
Japanese (ja)
Inventor
Hideo Asahina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP13548378A priority Critical patent/JPS5562762A/en
Publication of JPS5562762A publication Critical patent/JPS5562762A/en
Pending legal-status Critical Current

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  • Bipolar Integrated Circuits (AREA)

Abstract

PURPOSE: To advantageously design a semiconductor device by approaching the current amplification factor, saturated resistance and maximum current or the like characteristics of a PNP transistor to an NPN transistor in a complementary integrated circuit (IC).
CONSTITUTION: A substrate 32 superimposed with N-type epitaxial layers 26, 31 on a P-type silicon layer 21 is isolated via P-type layers 25a∼25c, in a PNP transistor an emitter is formed by a layer 34, a base is by a layer 37, and a collector by a buried layer 24, and in an NPN transistor 40 an emitter is formed by a layer 38, a base by a buried layer 39, and a collector by layer 41 outside the layers 29, 33. Since the buried layer 30 of high density is interposed between the layers 26 and 31 in a transistor 39, it is difficult to punch through the emitter and the collector. The layer 30 is separated from the buried layer 24 to enhance the dielectric strength between the emitter and the collector thereof. Since a high density layer 28 is provided regardless of the base 29 of the NPN transistor 40 between the buried layer 24 and the collector electrode 42C, its saturated resistance is decreased for large current. Thus, the characteristics of both the transistor can approach to each other.
COPYRIGHT: (C)1980,JPO&Japio
JP13548378A 1978-11-02 1978-11-02 Semiconductor device Pending JPS5562762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13548378A JPS5562762A (en) 1978-11-02 1978-11-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13548378A JPS5562762A (en) 1978-11-02 1978-11-02 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5562762A true JPS5562762A (en) 1980-05-12

Family

ID=15152765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13548378A Pending JPS5562762A (en) 1978-11-02 1978-11-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5562762A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4458158A (en) * 1979-03-12 1984-07-03 Sprague Electric Company IC Including small signal and power devices
JP2007180472A (en) * 2005-11-30 2007-07-12 Sanyo Electric Co Ltd Semiconductor device and its fabrication process
US7619299B2 (en) * 2005-11-30 2009-11-17 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4458158A (en) * 1979-03-12 1984-07-03 Sprague Electric Company IC Including small signal and power devices
JP2007180472A (en) * 2005-11-30 2007-07-12 Sanyo Electric Co Ltd Semiconductor device and its fabrication process
US7619299B2 (en) * 2005-11-30 2009-11-17 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same

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