JPS5557974U - - Google Patents

Info

Publication number
JPS5557974U
JPS5557974U JP1978140696U JP14069678U JPS5557974U JP S5557974 U JPS5557974 U JP S5557974U JP 1978140696 U JP1978140696 U JP 1978140696U JP 14069678 U JP14069678 U JP 14069678U JP S5557974 U JPS5557974 U JP S5557974U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1978140696U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978140696U priority Critical patent/JPS5557974U/ja
Publication of JPS5557974U publication Critical patent/JPS5557974U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Multi-Conductor Connections (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1978140696U 1978-10-16 1978-10-16 Pending JPS5557974U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978140696U JPS5557974U (ja) 1978-10-16 1978-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978140696U JPS5557974U (ja) 1978-10-16 1978-10-16

Publications (1)

Publication Number Publication Date
JPS5557974U true JPS5557974U (ja) 1980-04-19

Family

ID=29115885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978140696U Pending JPS5557974U (ja) 1978-10-16 1978-10-16

Country Status (1)

Country Link
JP (1) JPS5557974U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール

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