JPS5553448A - Semiconductor element holding tape and mounting of element on wafer - Google Patents
Semiconductor element holding tape and mounting of element on waferInfo
- Publication number
- JPS5553448A JPS5553448A JP12624278A JP12624278A JPS5553448A JP S5553448 A JPS5553448 A JP S5553448A JP 12624278 A JP12624278 A JP 12624278A JP 12624278 A JP12624278 A JP 12624278A JP S5553448 A JPS5553448 A JP S5553448A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- wafer
- glueing
- transistor
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12624278A JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12624278A JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5553448A true JPS5553448A (en) | 1980-04-18 |
JPS6135696B2 JPS6135696B2 (ja) | 1986-08-14 |
Family
ID=14930304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12624278A Granted JPS5553448A (en) | 1978-10-16 | 1978-10-16 | Semiconductor element holding tape and mounting of element on wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5553448A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
JPS5840858U (ja) * | 1981-08-26 | 1983-03-17 | クラリオン株式会社 | チツプ部品 |
JPS58196099A (ja) * | 1982-05-11 | 1983-11-15 | 松下電器産業株式会社 | 電子部品装着装置 |
US4489487A (en) * | 1981-02-10 | 1984-12-25 | Robert Bosch Gmbh | Electronic component and adhesive strip combination, and method of attachment of component to a substrate |
DE10044418A1 (de) * | 2000-09-08 | 2002-04-18 | Siemens Ag | Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62151865U (ja) * | 1986-03-18 | 1987-09-26 |
-
1978
- 1978-10-16 JP JP12624278A patent/JPS5553448A/ja active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
US4489487A (en) * | 1981-02-10 | 1984-12-25 | Robert Bosch Gmbh | Electronic component and adhesive strip combination, and method of attachment of component to a substrate |
JPS5840858U (ja) * | 1981-08-26 | 1983-03-17 | クラリオン株式会社 | チツプ部品 |
JPS58196099A (ja) * | 1982-05-11 | 1983-11-15 | 松下電器産業株式会社 | 電子部品装着装置 |
JPH0147918B2 (ja) * | 1982-05-11 | 1989-10-17 | Matsushita Electric Ind Co Ltd | |
DE10044418A1 (de) * | 2000-09-08 | 2002-04-18 | Siemens Ag | Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
DE10044418C2 (de) * | 2000-09-08 | 2002-09-19 | Siemens Ag | Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
Also Published As
Publication number | Publication date |
---|---|
JPS6135696B2 (ja) | 1986-08-14 |
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