JPS554922A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS554922A
JPS554922A JP7647878A JP7647878A JPS554922A JP S554922 A JPS554922 A JP S554922A JP 7647878 A JP7647878 A JP 7647878A JP 7647878 A JP7647878 A JP 7647878A JP S554922 A JPS554922 A JP S554922A
Authority
JP
Japan
Prior art keywords
air vent
frame
resin
vent section
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7647878A
Other languages
Japanese (ja)
Other versions
JPS624862B2 (en
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Nobuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647878A priority Critical patent/JPS554922A/en
Publication of JPS554922A publication Critical patent/JPS554922A/en
Publication of JPS624862B2 publication Critical patent/JPS624862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate flash removal of air vent section, having been molded, by making adhering strength between a lead frame and a resin larger than that between a mold type air vent section and a resin. CONSTITUTION:Surface of a lead frame 11 on the side of an air vent section 31 is polished with a emerry paper, etc., to provide rough surface so that resin adheres to the frame 11 tighter than to metallic molds 2 and 3. It is possible, in this manner, to make flash generated on the air vent section 31 adhere not to the metal molds but to the frame 11 when the metal molds are removed, and therefore, it is possible to continue operation. Further, it is recommendable to rough entire surface except a frame section 12 on the gate side so that moisuture-proof performance of resin mold IC can be improved.
JP7647878A 1978-06-26 1978-06-26 Lead frame Granted JPS554922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Publications (2)

Publication Number Publication Date
JPS554922A true JPS554922A (en) 1980-01-14
JPS624862B2 JPS624862B2 (en) 1987-02-02

Family

ID=13606292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647878A Granted JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS554922A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146956U (en) * 1985-02-28 1986-09-10
JPS61146955U (en) * 1985-02-28 1986-09-10
JPS61162063U (en) * 1985-03-28 1986-10-07
JPS61269351A (en) * 1985-05-23 1986-11-28 Nec Yamagata Ltd Lead frame for semiconductor device
JPS61203562U (en) * 1985-06-07 1986-12-22
JPS6268718A (en) * 1985-09-20 1987-03-28 Matsushita Electric Ind Co Ltd Disc type recording medium molding mold
JPS6276543U (en) * 1985-10-31 1987-05-16
JPS62134253U (en) * 1986-02-14 1987-08-24
KR100242249B1 (en) * 1997-05-13 2000-02-01 김규현 Package moulding structure and semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4219003A1 (en) 2020-09-24 2023-08-02 Nippon Kayaku Kabushiki Kaisha Catalyst precursor, catalyst using same, production method for compound and production method for catalyst

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146956U (en) * 1985-02-28 1986-09-10
JPS61146955U (en) * 1985-02-28 1986-09-10
JPS61162063U (en) * 1985-03-28 1986-10-07
JPS61269351A (en) * 1985-05-23 1986-11-28 Nec Yamagata Ltd Lead frame for semiconductor device
JPS61203562U (en) * 1985-06-07 1986-12-22
JPS6268718A (en) * 1985-09-20 1987-03-28 Matsushita Electric Ind Co Ltd Disc type recording medium molding mold
JPS6276543U (en) * 1985-10-31 1987-05-16
JPS62134253U (en) * 1986-02-14 1987-08-24
KR100242249B1 (en) * 1997-05-13 2000-02-01 김규현 Package moulding structure and semiconductor package

Also Published As

Publication number Publication date
JPS624862B2 (en) 1987-02-02

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