JPS5543829A - Method of treatment of semiconductor substrate - Google Patents
Method of treatment of semiconductor substrateInfo
- Publication number
- JPS5543829A JPS5543829A JP11636578A JP11636578A JPS5543829A JP S5543829 A JPS5543829 A JP S5543829A JP 11636578 A JP11636578 A JP 11636578A JP 11636578 A JP11636578 A JP 11636578A JP S5543829 A JPS5543829 A JP S5543829A
- Authority
- JP
- Japan
- Prior art keywords
- base board
- dicing
- stage
- drying
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To eliminate occurrence of defective cracks on a semiconductor base board in manufacturing processes and to improve production recovery rate by conducting a series of treatment operations such as dicing, washing and drying, etc., while keeping the semiconductor base board on a base board table.
CONSTITUTION: A base board table 2 is placed on a stage 1 of a dicing device, a semiconductor base board 3 to be treated is placed on this, a stage 1 is vacuumized, and then, the base board 3 and the base board table 2 are fixed onto the stage 1. By driving a dicing saw, a cut groove 4 is formed on the base board 3. After completion of the dicing operation, the vcuumized condition is removed, the semiconductor base board 3 on the base board table 2 is taken out as they are, and washed by spray of cleaning liquid, and then, dehydrating and drying treatments are carried out by using centrifugal dehydrating and drying device. After these treating operations, the base board 3 is pressed by roller for cracking and shred into pellets.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636578A JPS5543829A (en) | 1978-09-21 | 1978-09-21 | Method of treatment of semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636578A JPS5543829A (en) | 1978-09-21 | 1978-09-21 | Method of treatment of semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5543829A true JPS5543829A (en) | 1980-03-27 |
Family
ID=14685152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11636578A Pending JPS5543829A (en) | 1978-09-21 | 1978-09-21 | Method of treatment of semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543829A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169936A (en) * | 1982-03-30 | 1983-10-06 | Nec Home Electronics Ltd | Dicing method |
| JPH04186157A (en) * | 1990-11-21 | 1992-07-02 | Agency Of Ind Science & Technol | Mineral separator device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49105445A (en) * | 1973-02-07 | 1974-10-05 | ||
| JPS5252568A (en) * | 1975-10-27 | 1977-04-27 | Nec Corp | Production of semiconductor element |
| JPS52129372A (en) * | 1976-04-23 | 1977-10-29 | Seiko Epson Corp | Pelletizing method for semiconductor wafers |
-
1978
- 1978-09-21 JP JP11636578A patent/JPS5543829A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49105445A (en) * | 1973-02-07 | 1974-10-05 | ||
| JPS5252568A (en) * | 1975-10-27 | 1977-04-27 | Nec Corp | Production of semiconductor element |
| JPS52129372A (en) * | 1976-04-23 | 1977-10-29 | Seiko Epson Corp | Pelletizing method for semiconductor wafers |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169936A (en) * | 1982-03-30 | 1983-10-06 | Nec Home Electronics Ltd | Dicing method |
| JPH04186157A (en) * | 1990-11-21 | 1992-07-02 | Agency Of Ind Science & Technol | Mineral separator device |
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