JPS5539665A - Die device for charge and formation of semiconductor element - Google Patents

Die device for charge and formation of semiconductor element

Info

Publication number
JPS5539665A
JPS5539665A JP11295978A JP11295978A JPS5539665A JP S5539665 A JPS5539665 A JP S5539665A JP 11295978 A JP11295978 A JP 11295978A JP 11295978 A JP11295978 A JP 11295978A JP S5539665 A JPS5539665 A JP S5539665A
Authority
JP
Japan
Prior art keywords
cavity
plate
forming
block
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11295978A
Other languages
English (en)
Other versions
JPS5610785B2 (ja
Inventor
Kazuo Bando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOA SEIMITSU KOGYO KK
Original Assignee
TOA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOA SEIMITSU KOGYO KK filed Critical TOA SEIMITSU KOGYO KK
Priority to JP11295978A priority Critical patent/JPS5539665A/ja
Publication of JPS5539665A publication Critical patent/JPS5539665A/ja
Publication of JPS5610785B2 publication Critical patent/JPS5610785B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP11295978A 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element Granted JPS5539665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11295978A JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11295978A JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5539665A true JPS5539665A (en) 1980-03-19
JPS5610785B2 JPS5610785B2 (ja) 1981-03-10

Family

ID=14599809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11295978A Granted JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5539665A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS60131212A (ja) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk トランスフア成形用金型
JP2009196167A (ja) * 2008-02-20 2009-09-03 Towa Corp 電子部品の圧縮成形方法及び金型

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980074U (ja) * 1982-11-19 1984-05-30 日本橋住建株式会社 物品収納縁を有するサツシ枠

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (ja) * 1982-08-09 1984-02-18 坂東　一雄 半導体樹脂封入成形用の成形装置
JPS6233317Y2 (ja) * 1982-08-09 1987-08-26
JPS60131212A (ja) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk トランスフア成形用金型
JPS6144646B2 (ja) * 1983-12-20 1986-10-03 Yamada Seisakusho Kk
JP2009196167A (ja) * 2008-02-20 2009-09-03 Towa Corp 電子部品の圧縮成形方法及び金型

Also Published As

Publication number Publication date
JPS5610785B2 (ja) 1981-03-10

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