JPS5539665A - Die device for charge and formation of semiconductor element - Google Patents

Die device for charge and formation of semiconductor element

Info

Publication number
JPS5539665A
JPS5539665A JP11295978A JP11295978A JPS5539665A JP S5539665 A JPS5539665 A JP S5539665A JP 11295978 A JP11295978 A JP 11295978A JP 11295978 A JP11295978 A JP 11295978A JP S5539665 A JPS5539665 A JP S5539665A
Authority
JP
Japan
Prior art keywords
cavity
plate
forming
block
charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11295978A
Other languages
Japanese (ja)
Other versions
JPS5610785B2 (en
Inventor
Kazuo Bando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOA SEIMITSU KOGYO KK
Original Assignee
TOA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOA SEIMITSU KOGYO KK filed Critical TOA SEIMITSU KOGYO KK
Priority to JP11295978A priority Critical patent/JPS5539665A/en
Publication of JPS5539665A publication Critical patent/JPS5539665A/en
Publication of JPS5610785B2 publication Critical patent/JPS5610785B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To obtain the head part without a divided line in the die by dividing only the body part of the forming into the fixed cavity and movable cavity and by pouring the resin engaging both the body and head part in the combined form at the time of die pressing.
CONSTITUTION: A plate of fixing side 12 is installed under an attaching plate for fixing side 11 through a spacer block 10 and then a block 13 in which a cavity 14a to form a half part of the body part of the forming is installed under the plate 12 in the combined mode. Further, in its central part, a pocket 15 to pour the raw plastic material, is placed and then an inclined pin 16 to assemble with an attaching place for the movable side 26 is profeted in the plate 12. On the other hand, a plate for movable side 20 is installed to a plate 26 to engage with it through a spacer block 25 and a block 21 having a cavity 14b corresponding with the cavity 14a, is installed. By doing so, the forming material is positioned in the cavity inside, putting the cavity 14a and 14b together and then the plastic material is poured herefor forming.
COPYRIGHT: (C)1980,JPO&Japio
JP11295978A 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element Granted JPS5539665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11295978A JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11295978A JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Publications (2)

Publication Number Publication Date
JPS5539665A true JPS5539665A (en) 1980-03-19
JPS5610785B2 JPS5610785B2 (en) 1981-03-10

Family

ID=14599809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11295978A Granted JPS5539665A (en) 1978-09-14 1978-09-14 Die device for charge and formation of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5539665A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (en) * 1982-08-09 1984-02-18 坂東　一雄 Molding equipment for semiconductor resin encapsulation molding
JPS60131212A (en) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk Mold for transfer molding
JP2009196167A (en) * 2008-02-20 2009-09-03 Towa Corp Compression molding method and die for electronic component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980074U (en) * 1982-11-19 1984-05-30 日本橋住建株式会社 Satsushi frame with article storage edge

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926244U (en) * 1982-08-09 1984-02-18 坂東　一雄 Molding equipment for semiconductor resin encapsulation molding
JPS6233317Y2 (en) * 1982-08-09 1987-08-26
JPS60131212A (en) * 1983-12-20 1985-07-12 Yamada Seisakusho:Kk Mold for transfer molding
JPS6144646B2 (en) * 1983-12-20 1986-10-03 Yamada Seisakusho Kk
JP2009196167A (en) * 2008-02-20 2009-09-03 Towa Corp Compression molding method and die for electronic component

Also Published As

Publication number Publication date
JPS5610785B2 (en) 1981-03-10

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