JPS553462A - Silver paste - Google Patents

Silver paste

Info

Publication number
JPS553462A
JPS553462A JP7647578A JP7647578A JPS553462A JP S553462 A JPS553462 A JP S553462A JP 7647578 A JP7647578 A JP 7647578A JP 7647578 A JP7647578 A JP 7647578A JP S553462 A JPS553462 A JP S553462A
Authority
JP
Japan
Prior art keywords
silver
synthetic resin
paste
objective
short fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7647578A
Other languages
Japanese (ja)
Inventor
Hiroshi Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647578A priority Critical patent/JPS553462A/en
Publication of JPS553462A publication Critical patent/JPS553462A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To increase the heat conductivity of a silver paste, to improve the wire- bonding efficiency, and to decrease the rejection rate of a semiconductor device remarkably, by adding short fibers of silver to a synthetic resin binder.
CONSTITUTION: The objective paste is prepared by mixing (A) a synthetic resin binder such as epoxy-polyimide resin and (B) sliver short fibers. For example, 75 wt% of silver fibers having a diameter of about 5μ and a length of about 150μ, 20 wt% of a synthetic resin, and 5 wt% of n-butyl alcohol are homogeneously mixed to obtain the objective heat-conductive paste.
COPYRIGHT: (C)1980,JPO&Japio
JP7647578A 1978-06-26 1978-06-26 Silver paste Pending JPS553462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647578A JPS553462A (en) 1978-06-26 1978-06-26 Silver paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647578A JPS553462A (en) 1978-06-26 1978-06-26 Silver paste

Publications (1)

Publication Number Publication Date
JPS553462A true JPS553462A (en) 1980-01-11

Family

ID=13606201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647578A Pending JPS553462A (en) 1978-06-26 1978-06-26 Silver paste

Country Status (1)

Country Link
JP (1) JPS553462A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576277A (en) * 1980-06-13 1982-01-13 Nippon Kokan Kk Apparatus for treating molten slag
JPH06299129A (en) * 1993-04-12 1994-10-25 Nec Corp Adhesive for electronic device
CN106385769A (en) * 2016-09-08 2017-02-08 信阳师范学院 Manufacturing method of sliver fiber flexible circuit based on taking cotton as template

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576277A (en) * 1980-06-13 1982-01-13 Nippon Kokan Kk Apparatus for treating molten slag
JPH06299129A (en) * 1993-04-12 1994-10-25 Nec Corp Adhesive for electronic device
CN106385769A (en) * 2016-09-08 2017-02-08 信阳师范学院 Manufacturing method of sliver fiber flexible circuit based on taking cotton as template
CN106385769B (en) * 2016-09-08 2018-09-04 信阳师范学院 Production method based on the silver fiber flexible circuit that cotton is template

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