JPS5526696A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5526696A
JPS5526696A JP9613679A JP9613679A JPS5526696A JP S5526696 A JPS5526696 A JP S5526696A JP 9613679 A JP9613679 A JP 9613679A JP 9613679 A JP9613679 A JP 9613679A JP S5526696 A JPS5526696 A JP S5526696A
Authority
JP
Japan
Prior art keywords
frame
block
rail
guide rail
deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9613679A
Other languages
Japanese (ja)
Other versions
JPS5933978B2 (en
Inventor
Fumio Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP54096136A priority Critical patent/JPS5933978B2/en
Publication of JPS5526696A publication Critical patent/JPS5526696A/en
Publication of JPS5933978B2 publication Critical patent/JPS5933978B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To certainly perform a tailless bonding by preventing a deformation of a frame while supporting the lead frame provided on a heat block with a guide rail and press plate.
CONSTITUTION: A guide rail 3 and 4 supported by a support plate 8 and 9 are arranged in the side of a heat block 1 having a cartridge heater 2 accommodated in the center, and a lead frame 7 is guided by utilizing a guide face 5 and 6 and the upper face of the block 1. When a wire bonding device is constructed by such a manner, a frame press plates 13 and 14 are mounted on the rail 3 and 4 to make sure the contact between the block 1 and the frame 7. A press plate 11 is mounted in the vicinity of a positioning pin 10 provided in the rail 3 to block a pressing force applied in the vertical direction of the frame 7. A semiconductor pellet sticked to the top end of a collet 12 by mounting the frame 7 on the block 1 without giving any deformation against it, can be firmly fixed on a tab 15 on the frame 7.
COPYRIGHT: (C)1980,JPO&Japio
JP54096136A 1979-07-30 1979-07-30 Bonding method Expired JPS5933978B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54096136A JPS5933978B2 (en) 1979-07-30 1979-07-30 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54096136A JPS5933978B2 (en) 1979-07-30 1979-07-30 Bonding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13364774A Division JPS5160160A (en) 1974-11-22 1974-11-22 BONDEING USOCHI

Publications (2)

Publication Number Publication Date
JPS5526696A true JPS5526696A (en) 1980-02-26
JPS5933978B2 JPS5933978B2 (en) 1984-08-20

Family

ID=14156966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54096136A Expired JPS5933978B2 (en) 1979-07-30 1979-07-30 Bonding method

Country Status (1)

Country Link
JP (1) JPS5933978B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5788743A (en) * 1980-11-21 1982-06-02 Shinkawa Ltd Positioning device for vertical-type lead frame
JPS63181275U (en) * 1987-05-18 1988-11-22
JPH0611350U (en) * 1992-07-10 1994-02-10 株式会社新川 Bonding device
US6135270A (en) * 1998-03-31 2000-10-24 Kabushiki Kaisha Shinkawa Guide rail mechanism for a bonding apparatus
US6145651A (en) * 1998-03-31 2000-11-14 Kabushiki Kaisha Shinkawa Guide rail mechanism for a bonding apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5788743A (en) * 1980-11-21 1982-06-02 Shinkawa Ltd Positioning device for vertical-type lead frame
JPS627697B2 (en) * 1980-11-21 1987-02-18 Shinkawa Kk
JPS63181275U (en) * 1987-05-18 1988-11-22
JPH0611350U (en) * 1992-07-10 1994-02-10 株式会社新川 Bonding device
US6135270A (en) * 1998-03-31 2000-10-24 Kabushiki Kaisha Shinkawa Guide rail mechanism for a bonding apparatus
US6145651A (en) * 1998-03-31 2000-11-14 Kabushiki Kaisha Shinkawa Guide rail mechanism for a bonding apparatus

Also Published As

Publication number Publication date
JPS5933978B2 (en) 1984-08-20

Similar Documents

Publication Publication Date Title
JPS5526696A (en) Bonding method
JPS55121654A (en) Compression bonded semiconductor device
JPS5526697A (en) Pellet bonding device
KR880013244A (en) Bonding method and apparatus of lead wire of IC (Integrated Circuit) device
JPS556900A (en) Bonding device
IT1215267B (en) APPARATUS AND METHOD FOR THE PERFECTED THERMAL COUPLING OF A SEMICONDUCTOR CONTAINER TO A COOLING PLATE AND THE INCREASED ELECTRICAL COUPLING OF CONTAINER CONDUCTORS ON MORE THAN ONE SIDE OF THE CONTAINER ON A CIRCUIT BOARD.
JPS5572065A (en) Plastic-molded type semiconductor device
CN220761452U (en) Welding die structure
JPH01198038A (en) Semiconductor manufacturing apparatus
JPS57197845A (en) Lead frame for transistor
JPS54137962A (en) Lead frame with heat sink
JPS5824443Y2 (en) Lead frame holding device
JPS57208166A (en) Lead frame for semiconductor device
JPS6299185A (en) Card emboss transferring mechanism
JP2676231B2 (en) Resin encapsulation equipment for semiconductor devices
JPS5788743A (en) Positioning device for vertical-type lead frame
JPS5766656A (en) Lead frame for semiconductor device
JPS57107042A (en) Semiconductor integrated circuit device
JPS6451628A (en) Wire bonding device
JPS57103340A (en) Resin sealing method for semiconductor device and lead frame used therefor
JPS58199531A (en) Gate cutting method for molded lead frame
JPS56137664A (en) Lead frame and semiconductor device having lead frame
JPS6432661A (en) Semiconductor manufacturing equipment
JPS647626A (en) Semiconductor device
KR970018330A (en) Leadframe Fixture