JPS55162293A - Method of manufacturing printed board* material and device - Google Patents
Method of manufacturing printed board* material and deviceInfo
- Publication number
- JPS55162293A JPS55162293A JP6875179A JP6875179A JPS55162293A JP S55162293 A JPS55162293 A JP S55162293A JP 6875179 A JP6875179 A JP 6875179A JP 6875179 A JP6875179 A JP 6875179A JP S55162293 A JPS55162293 A JP S55162293A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- manufacturing printed
- manufacturing
- board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0027—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using protective coatings or layers by lamination or by fusion of the coatings or layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70735576A | 1976-07-21 | 1976-07-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55162293A true JPS55162293A (en) | 1980-12-17 |
Family
ID=24841370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6875179A Pending JPS55162293A (en) | 1976-07-21 | 1979-06-01 | Method of manufacturing printed board* material and device |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS55162293A (en) |
BE (1) | BE882957A (en) |
DE (1) | DE2922304A1 (en) |
FR (1) | FR2458202B1 (en) |
GB (1) | GB2050702B (en) |
NL (1) | NL8001942A (en) |
SE (1) | SE440844B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015195329A (en) * | 2014-03-28 | 2015-11-05 | 株式会社秀峰 | Manufacturing method of conductive wiring, and conductive wiring |
JP2016039171A (en) * | 2014-08-05 | 2016-03-22 | 株式会社秀峰 | Method for manufacturing conductive wiring and conductive wiring |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1172112A (en) * | 1980-12-12 | 1984-08-07 | Richard P. Plunkett | Process for making conductive coatings |
FR2505367A1 (en) * | 1981-05-08 | 1982-11-12 | Lignes Telegraph Telephon | Plating conducting layer placed on dielectric - used for multilayer circuit for hybrid circuit |
DE19511553C2 (en) * | 1995-03-29 | 1997-02-20 | Litton Precision Prod Int | Method for producing electrically conductive structures, an electrically conductive structure obtained according to the method and combination for producing electrically conductive structures |
GB2380068B (en) * | 2001-09-15 | 2005-08-03 | Jaybee Graphics | Low Conductive Ink Composition |
WO2016166751A1 (en) | 2015-04-13 | 2016-10-20 | Printcb Ltd. | Printing of multi-layer circuits |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1075179B (en) * | 1960-02-11 | Woodbridge Suffolk Lawrence John Young (Großbritannien) | Process for the manufacture of printed circuits | |
GB691121A (en) * | 1950-07-11 | 1953-05-06 | Nat Res Dev | Improvements in or relating to the deposition of metals on surfaces |
FR1420044A (en) * | 1963-12-26 | 1965-12-03 | Matsushita Electric Ind Co Ltd | Manufacturing process of printed circuits |
US3506482A (en) * | 1967-04-25 | 1970-04-14 | Matsushita Electric Ind Co Ltd | Method of making printed circuits |
US3910852A (en) * | 1971-03-22 | 1975-10-07 | Conshohocken Chemicals Inc | Conductive resin composition |
-
1979
- 1979-05-31 DE DE19792922304 patent/DE2922304A1/en not_active Ceased
- 1979-05-31 FR FR7914024A patent/FR2458202B1/en not_active Expired
- 1979-06-01 GB GB7919160A patent/GB2050702B/en not_active Expired
- 1979-06-01 JP JP6875179A patent/JPS55162293A/en active Pending
-
1980
- 1980-03-26 SE SE8002343A patent/SE440844B/en unknown
- 1980-04-02 NL NL8001942A patent/NL8001942A/en not_active Application Discontinuation
- 1980-04-24 BE BE0/200356A patent/BE882957A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015195329A (en) * | 2014-03-28 | 2015-11-05 | 株式会社秀峰 | Manufacturing method of conductive wiring, and conductive wiring |
JP2016039171A (en) * | 2014-08-05 | 2016-03-22 | 株式会社秀峰 | Method for manufacturing conductive wiring and conductive wiring |
Also Published As
Publication number | Publication date |
---|---|
FR2458202A1 (en) | 1980-12-26 |
BE882957A (en) | 1980-10-24 |
FR2458202B1 (en) | 1985-10-25 |
GB2050702B (en) | 1984-02-08 |
DE2922304A1 (en) | 1981-04-09 |
SE440844B (en) | 1985-08-19 |
SE8002343L (en) | 1981-09-27 |
GB2050702A (en) | 1981-01-07 |
NL8001942A (en) | 1981-11-02 |
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