JPS55160440A - Device for fixing thin plate - Google Patents

Device for fixing thin plate

Info

Publication number
JPS55160440A
JPS55160440A JP6780579A JP6780579A JPS55160440A JP S55160440 A JPS55160440 A JP S55160440A JP 6780579 A JP6780579 A JP 6780579A JP 6780579 A JP6780579 A JP 6780579A JP S55160440 A JPS55160440 A JP S55160440A
Authority
JP
Japan
Prior art keywords
plate
thin plate
thin
layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6780579A
Other languages
Japanese (ja)
Inventor
Shinichiro Takasu
Ichiro Mori
Koichiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP6780579A priority Critical patent/JPS55160440A/en
Publication of JPS55160440A publication Critical patent/JPS55160440A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PURPOSE:To flatly adsorb the thin plate preferably even with convex and concave surface in mixture on a mirror surface thereof in a device for adsorbing and fixing the thin plate on a fixing plate by coating a thin layer made of material having low coefficnet of friction as compared with the thin plate on the surface of the fixing plate. CONSTITUTION:An exhaust pipe 4 connected to an exhaust pump 5 is inserted through the bottom surface of a container 3 opened at the upper surface, and a fixing plate 2 made of alumina sintered material or the like is hermetically attached as opened with a number of fine holes 1 onto the upper opening of the container 3. Then, a thin layer 14 having a thickness of approx. 1,000Angstrom made of fluorine resin formed with holes 15 corresponding to the fine holes 1 is coated on the surface of the plate 2. In this manner, the pump 5 is operated to evacuate the sealed space 16 to vacuum state to adsorb the curved thin plate 6 placed on the layer 14 through holes 1 and 15. Since the layer 14 having lower coefficient of friction than the plate 6 is interposed at this time, the thin plate 6 slides on the contact surface to enable preferable adhesion even with the rugged surface upside or downside.
JP6780579A 1979-05-31 1979-05-31 Device for fixing thin plate Pending JPS55160440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6780579A JPS55160440A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6780579A JPS55160440A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Publications (1)

Publication Number Publication Date
JPS55160440A true JPS55160440A (en) 1980-12-13

Family

ID=13355527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6780579A Pending JPS55160440A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Country Status (1)

Country Link
JP (1) JPS55160440A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554288A1 (en) * 1983-10-31 1985-05-03 Toshiba Machine Co Ltd ELECTROSTATIC CHUCKS
JPH01260955A (en) * 1988-04-11 1989-10-18 Nec Corp Line connection system
JPH03101247A (en) * 1988-11-30 1991-04-26 Tokyo Electron Ltd Resist processor
JPH03129750A (en) * 1987-10-12 1991-06-03 Tokyo Erekutoron Yamanashi Kk Chuck for transferring wafer-carrier
WO1997021243A1 (en) * 1995-12-04 1997-06-12 Hitachi, Ltd. Method for processing semiconductor wafer, method for manufacturing ic card, and carrier
CN103737453A (en) * 2013-10-25 2014-04-23 中国航天科工集团第三研究院第八三五八研究所 Vacuum adsorption device used in machining of laser gyroscope cavity horizontal moving mirrors
CN106984991A (en) * 2017-06-07 2017-07-28 苏州市意可机电有限公司 The processing technology and its special fixture of a kind of curved surface light-wall pipe

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554288A1 (en) * 1983-10-31 1985-05-03 Toshiba Machine Co Ltd ELECTROSTATIC CHUCKS
JPH03129750A (en) * 1987-10-12 1991-06-03 Tokyo Erekutoron Yamanashi Kk Chuck for transferring wafer-carrier
JPH01260955A (en) * 1988-04-11 1989-10-18 Nec Corp Line connection system
JPH03101247A (en) * 1988-11-30 1991-04-26 Tokyo Electron Ltd Resist processor
WO1997021243A1 (en) * 1995-12-04 1997-06-12 Hitachi, Ltd. Method for processing semiconductor wafer, method for manufacturing ic card, and carrier
US6342434B1 (en) 1995-12-04 2002-01-29 Hitachi, Ltd. Methods of processing semiconductor wafer, and producing IC card, and carrier
US6573158B2 (en) 1995-12-04 2003-06-03 Hitachi, Ltd. Methods of processing semiconductor wafer and producing IC card, and carrier
US6589855B2 (en) 1995-12-04 2003-07-08 Hitachi, Ltd. Methods of processing semiconductor wafer and producing IC card, and carrier
CN103737453A (en) * 2013-10-25 2014-04-23 中国航天科工集团第三研究院第八三五八研究所 Vacuum adsorption device used in machining of laser gyroscope cavity horizontal moving mirrors
CN106984991A (en) * 2017-06-07 2017-07-28 苏州市意可机电有限公司 The processing technology and its special fixture of a kind of curved surface light-wall pipe

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