JPS5472696A - Package for super miniature size piezoelectric oscillator - Google Patents

Package for super miniature size piezoelectric oscillator

Info

Publication number
JPS5472696A
JPS5472696A JP13964177A JP13964177A JPS5472696A JP S5472696 A JPS5472696 A JP S5472696A JP 13964177 A JP13964177 A JP 13964177A JP 13964177 A JP13964177 A JP 13964177A JP S5472696 A JPS5472696 A JP S5472696A
Authority
JP
Japan
Prior art keywords
package
plate glass
lead film
oscillator
metallic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13964177A
Other languages
Japanese (ja)
Inventor
Yukio Miya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP13964177A priority Critical patent/JPS5472696A/en
Publication of JPS5472696A publication Critical patent/JPS5472696A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Abstract

PURPOSE:To make easy for the connection of the circuit substrate to the oscillation circuit, by forming the metallic conductive lead film on the lower surface of the oscillator package such as plate glass from the upper surfacevia the edge surface of through-hole. CONSTITUTION::The concave 15a is placed on the plate glass 15 with etching technology, the metallic conductive lead film 14 is formed on the upper, edge and lower surface of the plate glass with for example, vaccum evaporation, sputtering method or lift off method for Cr-Au or Cr-Ni-Pd, the oscillator 20 is fitted at the upper surface and the insulation layer 16 is provided, consisting of SiO2, and the package cover 16 is sealed in vaccum via the cover bonding layer 17 consisting of Cr-Ni-Pd and soft metal 19. Or, the metallic conductive lead film 14 is led to the lower surface via the through-hole 21 placed on the plate glass 15. Accordingly, the lead film 14 formed under the package is placed on the oscillator circuit and the connection is made easy.
JP13964177A 1977-11-21 1977-11-21 Package for super miniature size piezoelectric oscillator Pending JPS5472696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13964177A JPS5472696A (en) 1977-11-21 1977-11-21 Package for super miniature size piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13964177A JPS5472696A (en) 1977-11-21 1977-11-21 Package for super miniature size piezoelectric oscillator

Publications (1)

Publication Number Publication Date
JPS5472696A true JPS5472696A (en) 1979-06-11

Family

ID=15249999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13964177A Pending JPS5472696A (en) 1977-11-21 1977-11-21 Package for super miniature size piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPS5472696A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138115A (en) * 1982-02-12 1983-08-16 Murata Mfg Co Ltd Chip-shaped piezoelectric oscillating component
JPS58139513A (en) * 1982-05-11 1983-08-18 Murata Mfg Co Ltd Chip-shaped piezoelectric oscillating parts
JPS58169715U (en) * 1982-05-06 1983-11-12 富士産業株式会社 Chip type piezoelectric vibrator
JPS58197909A (en) * 1982-05-13 1983-11-17 Murata Mfg Co Ltd Mounting structure of chip-like piezo-electric oscillation part
JPS5936618U (en) * 1982-08-31 1984-03-07 キンセキ株式会社 piezoelectric vibrator container
JPS5952720U (en) * 1982-09-24 1984-04-06 キンセキ株式会社 piezoelectric vibrator container
JPS5969528U (en) * 1982-10-28 1984-05-11 キンセキ株式会社 Airtight container for piezoelectric vibrator
JPS59152815U (en) * 1983-03-30 1984-10-13 キンセキ株式会社 piezoelectric vibrator
JPS6082832U (en) * 1983-11-15 1985-06-08 松下電器産業株式会社 Filter package
JPH0425315U (en) * 1990-06-25 1992-02-28
JPH0485825U (en) * 1990-11-28 1992-07-27
JP2007089117A (en) * 2005-08-24 2007-04-05 Seiko Instruments Inc Piezoelectric vibrator, oscillator, electronic component, electronic equipment, manufacturing method of piezoelectric vibrator, and manufacturing method of electronic component
JP2007129326A (en) * 2005-11-01 2007-05-24 Seiko Instruments Inc Piezoelectric resonator and manufacturing method thereof, oscillator, radio wave clock and electronic equipment
JP2009135745A (en) * 2007-11-30 2009-06-18 Nippon Dempa Kogyo Co Ltd Piezoelectric device for surface mounting
JP2011193291A (en) * 2010-03-15 2011-09-29 Seiko Instruments Inc Package, and method of manufacturing package
JP2012235203A (en) * 2011-04-28 2012-11-29 Seiko Npc Corp Crystal oscillator and assembly method therefor

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0155604B2 (en) * 1982-02-12 1989-11-27 Murata Manufacturing Co
JPS58138115A (en) * 1982-02-12 1983-08-16 Murata Mfg Co Ltd Chip-shaped piezoelectric oscillating component
JPS58169715U (en) * 1982-05-06 1983-11-12 富士産業株式会社 Chip type piezoelectric vibrator
JPS58139513A (en) * 1982-05-11 1983-08-18 Murata Mfg Co Ltd Chip-shaped piezoelectric oscillating parts
JPH0155605B2 (en) * 1982-05-11 1989-11-27 Murata Manufacturing Co
JPS58197909A (en) * 1982-05-13 1983-11-17 Murata Mfg Co Ltd Mounting structure of chip-like piezo-electric oscillation part
JPS5936618U (en) * 1982-08-31 1984-03-07 キンセキ株式会社 piezoelectric vibrator container
JPS5952720U (en) * 1982-09-24 1984-04-06 キンセキ株式会社 piezoelectric vibrator container
JPS5969528U (en) * 1982-10-28 1984-05-11 キンセキ株式会社 Airtight container for piezoelectric vibrator
JPS59152815U (en) * 1983-03-30 1984-10-13 キンセキ株式会社 piezoelectric vibrator
JPS6082832U (en) * 1983-11-15 1985-06-08 松下電器産業株式会社 Filter package
JPH0425315U (en) * 1990-06-25 1992-02-28
JPH0485825U (en) * 1990-11-28 1992-07-27
JP2007089117A (en) * 2005-08-24 2007-04-05 Seiko Instruments Inc Piezoelectric vibrator, oscillator, electronic component, electronic equipment, manufacturing method of piezoelectric vibrator, and manufacturing method of electronic component
JP2007129326A (en) * 2005-11-01 2007-05-24 Seiko Instruments Inc Piezoelectric resonator and manufacturing method thereof, oscillator, radio wave clock and electronic equipment
JP2009135745A (en) * 2007-11-30 2009-06-18 Nippon Dempa Kogyo Co Ltd Piezoelectric device for surface mounting
JP2011193291A (en) * 2010-03-15 2011-09-29 Seiko Instruments Inc Package, and method of manufacturing package
JP2012235203A (en) * 2011-04-28 2012-11-29 Seiko Npc Corp Crystal oscillator and assembly method therefor

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