JPS55148416A - Magazine for accommodating semiconductor substrate - Google Patents
Magazine for accommodating semiconductor substrateInfo
- Publication number
- JPS55148416A JPS55148416A JP5541279A JP5541279A JPS55148416A JP S55148416 A JPS55148416 A JP S55148416A JP 5541279 A JP5541279 A JP 5541279A JP 5541279 A JP5541279 A JP 5541279A JP S55148416 A JPS55148416 A JP S55148416A
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- semiconductor substrates
- accommodating semiconductor
- automatic transfer
- projections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
PURPOSE:To perform the automatic transfer of magazine for accommodating semiconductor substrates easily and securely by a method wherein a pair of projection engaging with an automatic transfer is provided at the side face of a magazine for accommodating semiconductor substrates. CONSTITUTION:Projections are provided at the both side faces of a magazine 2 accommodating semiconductor substrates 1, and after the magazine is located, an automatic device such as, for example, a chuck 4 having automatic switching mechanism, etc., is lowered from upper part to the space between projections 3 of magazine, and by opening the chuck 4 to hang the projections 3 of magazine, the automatic transfer of magazine is performed. By using a magazine like this, the automatic transfer can be performed easily and securely without affecting damage to the semiconductor substrates and unnecessitating jigs like handle, etc., for each magazine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5541279A JPS55148416A (en) | 1979-05-07 | 1979-05-07 | Magazine for accommodating semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5541279A JPS55148416A (en) | 1979-05-07 | 1979-05-07 | Magazine for accommodating semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55148416A true JPS55148416A (en) | 1980-11-19 |
Family
ID=12997837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5541279A Pending JPS55148416A (en) | 1979-05-07 | 1979-05-07 | Magazine for accommodating semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55148416A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285477A (en) * | 1976-01-09 | 1977-07-15 | Senken Kk | Wafer carrying container for integrated circuit |
| JPS53117976A (en) * | 1977-03-25 | 1978-10-14 | Hitachi Ltd | Parts treating vessel |
-
1979
- 1979-05-07 JP JP5541279A patent/JPS55148416A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5285477A (en) * | 1976-01-09 | 1977-07-15 | Senken Kk | Wafer carrying container for integrated circuit |
| JPS53117976A (en) * | 1977-03-25 | 1978-10-14 | Hitachi Ltd | Parts treating vessel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS57167625A (en) | Quartz boat for machining semiconductor wafer | |
| DE3569435D1 (en) | A process for annealing an ion implanted gallium arsenide substrate | |
| IL56224A (en) | Substrate clamp for use in semiconductor fabrication | |
| DE3165141D1 (en) | Process for doping semiconductors rapidly | |
| DE2966008D1 (en) | Device for the precise alignment of planar workpieces, e.g. semiconductor wafers | |
| DE3069784D1 (en) | Boat for conveying semiconductor substrates | |
| IL58747A0 (en) | Electrolyte contacts for semiconductor surfaces | |
| GB2007495B (en) | Carrier for semiconductor wafers | |
| JPS5645367A (en) | Liquid waxxless mounting tool for wafer with minute size | |
| JPS55148416A (en) | Magazine for accommodating semiconductor substrate | |
| JPS5440075A (en) | Compound semiconductor wafer | |
| JPS5434774A (en) | Article transfer device | |
| JPS54134973A (en) | Sheet holding jig for semiconductor wafer | |
| JPS5318967A (en) | Wafer sucking jig | |
| JPS54984A (en) | Containing tool for semiconductor wafer | |
| JPS5419673A (en) | Object trasfer device | |
| JPS5390871A (en) | Device for chucking semiconductor wafer | |
| JPS5624921A (en) | Transferring method of wafer | |
| JPS5242365A (en) | Tool for semiconductors | |
| JPS5439576A (en) | Inspection method for semiconductor device | |
| JPS55148417A (en) | Magazine case for accommodating semiconductor substrate | |
| JPS6422742A (en) | Wafer pushup tool and device for transfer of wafer | |
| JPS56130935A (en) | Inspecting device | |
| JPS53125776A (en) | Manufacture for semiconductor device | |
| JPS52153560A (en) | Plate clamping device |