JPS55147580A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPS55147580A JPS55147580A JP5572079A JP5572079A JPS55147580A JP S55147580 A JPS55147580 A JP S55147580A JP 5572079 A JP5572079 A JP 5572079A JP 5572079 A JP5572079 A JP 5572079A JP S55147580 A JPS55147580 A JP S55147580A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy compound
- melamine
- curing agent
- epoxy
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To provide a structural adhesive composition capable of simplifying an application procedure and excellent in strength, heat resistance and water resistance constituted by compounding an epoxy compound, a polyamide powder, a curing agent comprising melamine and imidazole and an org. solvent.
CONSTITUTION: (a) An epoxy compound having two or more of epoxy group in a molecule such as bisphenol A, (b) a polyamide resin powder with m.p. of 60W 200°C and an average particle size of below 50μ such as AMILAN CM-4,000 (trade name, produced by TOYO RAYON KK), (c) melamine (curing agent), (d) imidazoles (curing agent) such as 2-methylimidazole, and (e) a low b.p. org. solvent dissoving an epoxy compound but not a polyamide powder such as methyl ethyl ketone are compounded. In the above described compounding ratio, to 1pts.wt. epoxy compound (a), a polyamide resin (b) is 0.2W5pts.wt., melamine (c) is 0.01W0.5mol (per epoxy eq.) and imidazole (d) is 0.005W0.1pts.wt.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5572079A JPS55147580A (en) | 1979-05-09 | 1979-05-09 | Adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5572079A JPS55147580A (en) | 1979-05-09 | 1979-05-09 | Adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55147580A true JPS55147580A (en) | 1980-11-17 |
JPS5734876B2 JPS5734876B2 (en) | 1982-07-26 |
Family
ID=13006698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5572079A Granted JPS55147580A (en) | 1979-05-09 | 1979-05-09 | Adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55147580A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63132925A (en) * | 1986-11-25 | 1988-06-04 | Sumitomo Chem Co Ltd | Epoxy group-containing elastomer composition |
JPH02286738A (en) * | 1989-04-28 | 1990-11-26 | Somar Corp | Epoxy resin composition prevented from generating curing strain and method of bonding therewith |
JP2012191194A (en) * | 2011-02-23 | 2012-10-04 | Mitsubishi Chemicals Corp | Photoelectric conversion element, solar cell, solar cell module, and method for manufacturing the same |
JP2016505087A (en) * | 2013-01-29 | 2016-02-18 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | Fixing agent composition and primer composition for metal plastic hybrid member |
CN106916561A (en) * | 2015-12-16 | 2017-07-04 | 三键有限公司 | Form the resin combination of film |
WO2019054392A1 (en) * | 2017-09-15 | 2019-03-21 | 住友精化株式会社 | Epoxy resin composition |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175969U (en) * | 1987-05-01 | 1988-11-15 | ||
JPH0160108U (en) * | 1987-10-08 | 1989-04-17 |
-
1979
- 1979-05-09 JP JP5572079A patent/JPS55147580A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63132925A (en) * | 1986-11-25 | 1988-06-04 | Sumitomo Chem Co Ltd | Epoxy group-containing elastomer composition |
JPH02286738A (en) * | 1989-04-28 | 1990-11-26 | Somar Corp | Epoxy resin composition prevented from generating curing strain and method of bonding therewith |
JP2012191194A (en) * | 2011-02-23 | 2012-10-04 | Mitsubishi Chemicals Corp | Photoelectric conversion element, solar cell, solar cell module, and method for manufacturing the same |
JP2016505087A (en) * | 2013-01-29 | 2016-02-18 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | Fixing agent composition and primer composition for metal plastic hybrid member |
CN106916561A (en) * | 2015-12-16 | 2017-07-04 | 三键有限公司 | Form the resin combination of film |
WO2019054392A1 (en) * | 2017-09-15 | 2019-03-21 | 住友精化株式会社 | Epoxy resin composition |
CN111094449A (en) * | 2017-09-15 | 2020-05-01 | 住友精化株式会社 | Epoxy resin composition |
JPWO2019054392A1 (en) * | 2017-09-15 | 2020-10-15 | 住友精化株式会社 | Epoxy resin composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5734876B2 (en) | 1982-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860001167A (en) | Solvent-free polyimide-modified epoxy compositions | |
JPS55147580A (en) | Adhesive composition | |
JPS57147513A (en) | Varnish composition | |
JPS5679170A (en) | Adhesive composition | |
JPS5426000A (en) | Epoxy resin composition | |
JPS5359798A (en) | Epoxy resin composition of excellent warm-water resistance | |
JPH07119275B2 (en) | Two-component epoxy resin composition | |
KR920016541A (en) | Epoxy Resin Compositions Used in Electrical Laminates | |
EP0866109A4 (en) | ||
US5128059A (en) | Ring-alkylated m-phenylene diamine blends for use in curing epoxy resins | |
JPS5747365A (en) | Thermosetting resin composition | |
CA2026015A1 (en) | Polymeric compositions and components therefore | |
JPS5647445A (en) | Epoxy resin composition | |
JPS5483999A (en) | Energy ray-curable epoxy resin composition | |
JPS5643369A (en) | Composition for powder paint | |
JPS564637A (en) | Antistatic resin composition having excellent nonstickness | |
JPS55147524A (en) | Epoxy resin composition for prepreg | |
JPS544994A (en) | Epoxy resin composition | |
JPS5582138A (en) | Polyolefin resin composition | |
JPS54116097A (en) | Thermosetting resin composition | |
JPS57151623A (en) | Preparation of composite material | |
JPS57111315A (en) | One-component epoxy resin composition | |
JPS56104979A (en) | Thermosetting adhesive | |
JPS57187314A (en) | Energy ray-curable resin composition | |
JPH0441173B2 (en) |