JPS55147524A - Epoxy resin composition for prepreg - Google Patents
Epoxy resin composition for prepregInfo
- Publication number
- JPS55147524A JPS55147524A JP5574279A JP5574279A JPS55147524A JP S55147524 A JPS55147524 A JP S55147524A JP 5574279 A JP5574279 A JP 5574279A JP 5574279 A JP5574279 A JP 5574279A JP S55147524 A JPS55147524 A JP S55147524A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- prepregs
- epoxy
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
PURPOSE: Title composition which provides excellent heat resistance and flexibility, prepared by adding to a cycloaliphatic epoxy resin, a poly-p-vinylphenol resin, a phenol/formaldehyde condensate as a curing agent and an imidazole type compound as a cure accelerator.
CONSTITUTION: An epoxy resin composition for prepregs, prepared by adding to (A) 100pts.wt. of a cycloaliphatic epoxy resin, (B) 1W5pts.wt. of a poly-p- vinylphenol resin, softening point 140W190°C, (C) 25W50pts.wt. of a phenol/ formaldehyde condensate as a curing agent, (D) 0.1W15pts.wt. of at least one imidazole type compound, as a cure accelerator, selected from the group consisting of 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylim idazole. The windability during application to prepregs is improved by using as (A), a combination of 2-(3,4-epoxy)cycloh exyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxaneand 3,4-epoxycyclohexyl methyl 3,4-epoxycyclohexan ecarboxylaterepresented by the formula.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5574279A JPS55147524A (en) | 1979-05-09 | 1979-05-09 | Epoxy resin composition for prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5574279A JPS55147524A (en) | 1979-05-09 | 1979-05-09 | Epoxy resin composition for prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55147524A true JPS55147524A (en) | 1980-11-17 |
Family
ID=13007304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5574279A Pending JPS55147524A (en) | 1979-05-09 | 1979-05-09 | Epoxy resin composition for prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55147524A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5912920A (en) * | 1982-07-14 | 1984-01-23 | Mitsui Toatsu Chem Inc | Thermosetting epoxy resin composition |
| US4833204A (en) * | 1986-01-10 | 1989-05-23 | Hitachi Chemical Company, Ltd. | Epoxy resin composition for a copper-clad laminate |
| US7825197B2 (en) * | 2004-12-16 | 2010-11-02 | Daicel Chemical Industries, Ltd. | Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator |
-
1979
- 1979-05-09 JP JP5574279A patent/JPS55147524A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5912920A (en) * | 1982-07-14 | 1984-01-23 | Mitsui Toatsu Chem Inc | Thermosetting epoxy resin composition |
| JPH0324491B2 (en) * | 1982-07-14 | 1991-04-03 | Mitsui Toatsu Chemicals | |
| US4833204A (en) * | 1986-01-10 | 1989-05-23 | Hitachi Chemical Company, Ltd. | Epoxy resin composition for a copper-clad laminate |
| US7825197B2 (en) * | 2004-12-16 | 2010-11-02 | Daicel Chemical Industries, Ltd. | Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator |
| US8063156B2 (en) | 2004-12-16 | 2011-11-22 | Daicel Chemical Industries, Ltd. | Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst |
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