JPS55138280A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55138280A
JPS55138280A JP4494279A JP4494279A JPS55138280A JP S55138280 A JPS55138280 A JP S55138280A JP 4494279 A JP4494279 A JP 4494279A JP 4494279 A JP4494279 A JP 4494279A JP S55138280 A JPS55138280 A JP S55138280A
Authority
JP
Japan
Prior art keywords
layer
junction
junctions
electrode
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4494279A
Other languages
Japanese (ja)
Inventor
Kenji Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP4494279A priority Critical patent/JPS55138280A/en
Publication of JPS55138280A publication Critical patent/JPS55138280A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/8611Planar PN junction diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To miniaturize a varistor by laminating at least three pn-junctions perpendicularly inside a semiconductor substrate, attaching an electrode to the top layer and the bottom layer, and shorting the exposed surface on the even pn-junctions by a conductor. CONSTITUTION:One side of an n-type semiconductor substrate 8 is tripple diffused, and a p-layer 9, an n-layer 10 and a p-layer 11 are formed. A backward junction J2 is short-circuited at the Ag film 4a provided on the junction end J2. Films 6 and 7 are SiO2. When a forward current i is applied to electrode 1a junction J3 Ag film 4a junction J1 electrode 5. With such a structure as above-mentioned, a diffusion area corresponding to the number of junctions as with the case of a flat diffusion structure, so the coefficient of utilization of substrate area is greatly raised and the chip size is not expanded.
JP4494279A 1979-04-12 1979-04-12 Semiconductor device Pending JPS55138280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4494279A JPS55138280A (en) 1979-04-12 1979-04-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4494279A JPS55138280A (en) 1979-04-12 1979-04-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55138280A true JPS55138280A (en) 1980-10-28

Family

ID=12705531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4494279A Pending JPS55138280A (en) 1979-04-12 1979-04-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55138280A (en)

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