JPS55112754A - Cutting method of block unit - Google Patents

Cutting method of block unit

Info

Publication number
JPS55112754A
JPS55112754A JP1700479A JP1700479A JPS55112754A JP S55112754 A JPS55112754 A JP S55112754A JP 1700479 A JP1700479 A JP 1700479A JP 1700479 A JP1700479 A JP 1700479A JP S55112754 A JPS55112754 A JP S55112754A
Authority
JP
Japan
Prior art keywords
block unit
wire
shaft
prescribed
gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1700479A
Other languages
Japanese (ja)
Inventor
Kaoru Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1700479A priority Critical patent/JPS55112754A/en
Publication of JPS55112754A publication Critical patent/JPS55112754A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To increase the relative speed between wire and block unit and improve substantially the efficiency of cutting work, by such means as to rotate the block unit at a prescribed speed while pressing the block unit against the wire. CONSTITUTION:A cylindrical block unit 20, the objective material to be cut, is adhesively installed as an integral unit by a bonding agent to a mandrel 2A which is fixed to a shaft 9. This shaft 9 is supported by a bearing 9 provided in a prescribed position on a table 6, and a motor 12 is driven to rotate the shaft 9, that is, the block unit 20 in a prescribed direction through a gear 11 and a gear 10. Simultaneously the table 6 is shifted and urged by a dead weight 7 in a vertically upward direction to bring the cylindrical block unit 20 into cotact with a wire 4, causing the relative speed between the wire 4 and the block unit 20 to remarkably increase, thus cutting the block unit 20 efficiently.
JP1700479A 1979-02-15 1979-02-15 Cutting method of block unit Pending JPS55112754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1700479A JPS55112754A (en) 1979-02-15 1979-02-15 Cutting method of block unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1700479A JPS55112754A (en) 1979-02-15 1979-02-15 Cutting method of block unit

Publications (1)

Publication Number Publication Date
JPS55112754A true JPS55112754A (en) 1980-08-30

Family

ID=11931853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1700479A Pending JPS55112754A (en) 1979-02-15 1979-02-15 Cutting method of block unit

Country Status (1)

Country Link
JP (1) JPS55112754A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316967A (en) * 1986-07-03 1988-01-23 Matsushita Electric Ind Co Ltd Method for working hard and brittle material
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5735258A (en) * 1995-09-22 1998-04-07 Memc Electronic Materials, Inc. Cutting machine
US6109253A (en) * 1995-07-31 2000-08-29 Sharp Kabushiki Kaisha Method using a wire feeding device for a multi-wire saw

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151881A (en) * 1975-06-23 1976-12-27 Toshiba Corp Cutting method by wire
JPS52103786A (en) * 1976-02-27 1977-08-31 Hitachi Ltd Method of cutting crystal body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151881A (en) * 1975-06-23 1976-12-27 Toshiba Corp Cutting method by wire
JPS52103786A (en) * 1976-02-27 1977-08-31 Hitachi Ltd Method of cutting crystal body

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6316967A (en) * 1986-07-03 1988-01-23 Matsushita Electric Ind Co Ltd Method for working hard and brittle material
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
EP0747187A2 (en) * 1995-06-06 1996-12-11 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
EP0747187A3 (en) * 1995-06-06 1997-04-23 Corning Inc Apparatus and method for wire cutting glass-ceramic wafers
US6109253A (en) * 1995-07-31 2000-08-29 Sharp Kabushiki Kaisha Method using a wire feeding device for a multi-wire saw
US5735258A (en) * 1995-09-22 1998-04-07 Memc Electronic Materials, Inc. Cutting machine

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