JPS55111127A - Method for forming solder bump - Google Patents
Method for forming solder bumpInfo
- Publication number
- JPS55111127A JPS55111127A JP1820979A JP1820979A JPS55111127A JP S55111127 A JPS55111127 A JP S55111127A JP 1820979 A JP1820979 A JP 1820979A JP 1820979 A JP1820979 A JP 1820979A JP S55111127 A JPS55111127 A JP S55111127A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- layer
- solder
- photoresist
- damages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1820979A JPS55111127A (en) | 1979-02-19 | 1979-02-19 | Method for forming solder bump |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1820979A JPS55111127A (en) | 1979-02-19 | 1979-02-19 | Method for forming solder bump |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55111127A true JPS55111127A (en) | 1980-08-27 |
Family
ID=11965253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1820979A Pending JPS55111127A (en) | 1979-02-19 | 1979-02-19 | Method for forming solder bump |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55111127A (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
US5071787A (en) * | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
US5447264A (en) * | 1994-07-01 | 1995-09-05 | Mcnc | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
US5793116A (en) * | 1996-05-29 | 1998-08-11 | Mcnc | Microelectronic packaging using arched solder columns |
US5892179A (en) * | 1995-04-05 | 1999-04-06 | Mcnc | Solder bumps and structures for integrated redistribution routing conductors |
US5990472A (en) * | 1997-09-29 | 1999-11-23 | Mcnc | Microelectronic radiation detectors for detecting and emitting radiation signals |
US6388203B1 (en) | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
US6429030B1 (en) | 1999-02-08 | 2002-08-06 | Motorola, Inc. | Method for testing a semiconductor die using wells |
US7495326B2 (en) | 2002-10-22 | 2009-02-24 | Unitive International Limited | Stacked electronic structures including offset substrates |
US8674494B2 (en) | 2011-08-31 | 2014-03-18 | Samsung Electronics Co., Ltd. | Semiconductor package having supporting plate and method of forming the same |
-
1979
- 1979-02-19 JP JP1820979A patent/JPS55111127A/ja active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950623A (en) * | 1988-08-02 | 1990-08-21 | Microelectronics Center Of North Carolina | Method of building solder bumps |
US5071787A (en) * | 1989-03-14 | 1991-12-10 | Kabushiki Kaisha Toshiba | Semiconductor device utilizing a face-down bonding and a method for manufacturing the same |
US5289631A (en) * | 1992-03-04 | 1994-03-01 | Mcnc | Method for testing, burn-in, and/or programming of integrated circuit chips |
US5374893A (en) * | 1992-03-04 | 1994-12-20 | Mcnc | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US5381946A (en) * | 1992-03-04 | 1995-01-17 | Mcnc | Method of forming differing volume solder bumps |
US5447264A (en) * | 1994-07-01 | 1995-09-05 | Mcnc | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
US6222279B1 (en) | 1995-03-20 | 2001-04-24 | Mcnc | Solder bump fabrication methods and structures including a titanium barrier layer |
US5767010A (en) * | 1995-03-20 | 1998-06-16 | Mcnc | Solder bump fabrication methods and structure including a titanium barrier layer |
US6388203B1 (en) | 1995-04-04 | 2002-05-14 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
US6392163B1 (en) | 1995-04-04 | 2002-05-21 | Unitive International Limited | Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
US5892179A (en) * | 1995-04-05 | 1999-04-06 | Mcnc | Solder bumps and structures for integrated redistribution routing conductors |
US6329608B1 (en) | 1995-04-05 | 2001-12-11 | Unitive International Limited | Key-shaped solder bumps and under bump metallurgy |
US6389691B1 (en) | 1995-04-05 | 2002-05-21 | Unitive International Limited | Methods for forming integrated redistribution routing conductors and solder bumps |
US5793116A (en) * | 1996-05-29 | 1998-08-11 | Mcnc | Microelectronic packaging using arched solder columns |
US5990472A (en) * | 1997-09-29 | 1999-11-23 | Mcnc | Microelectronic radiation detectors for detecting and emitting radiation signals |
US6429030B1 (en) | 1999-02-08 | 2002-08-06 | Motorola, Inc. | Method for testing a semiconductor die using wells |
US7495326B2 (en) | 2002-10-22 | 2009-02-24 | Unitive International Limited | Stacked electronic structures including offset substrates |
US8674494B2 (en) | 2011-08-31 | 2014-03-18 | Samsung Electronics Co., Ltd. | Semiconductor package having supporting plate and method of forming the same |
US9412720B2 (en) | 2011-08-31 | 2016-08-09 | Samsung Electronics Co., Ltd. | Semiconductor package having supporting plate and method of forming the same |
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