JPS5434678A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5434678A
JPS5434678A JP10075977A JP10075977A JPS5434678A JP S5434678 A JPS5434678 A JP S5434678A JP 10075977 A JP10075977 A JP 10075977A JP 10075977 A JP10075977 A JP 10075977A JP S5434678 A JPS5434678 A JP S5434678A
Authority
JP
Japan
Prior art keywords
semiconductor device
plating
secure
applying
out wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10075977A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujii
Kenichi Tateno
Michinori Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP10075977A priority Critical patent/JPS5434678A/en
Publication of JPS5434678A publication Critical patent/JPS5434678A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4807—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H01L2224/48456—Shape
    • H01L2224/48458—Shape of the interface with the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure a rigid bonding by making coarse the surface of the foundation metal at the connective area of the external lead-out wire and then applying the Ni plating.
COPYRIGHT: (C)1979,JPO&Japio
JP10075977A 1977-08-22 1977-08-22 Semiconductor device Pending JPS5434678A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10075977A JPS5434678A (en) 1977-08-22 1977-08-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10075977A JPS5434678A (en) 1977-08-22 1977-08-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5434678A true JPS5434678A (en) 1979-03-14

Family

ID=14282429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10075977A Pending JPS5434678A (en) 1977-08-22 1977-08-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5434678A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167234A (en) * 1984-09-10 1986-04-07 Matsushita Electric Ind Co Ltd Lead wire connecting method for hybrid integrated circuit
JPS6249640A (en) * 1985-08-29 1987-03-04 Mitsubishi Electric Corp Gold electrode structure
US4767049A (en) * 1986-05-19 1988-08-30 Olin Corporation Special surfaces for wire bonding
US5165590A (en) * 1989-09-21 1992-11-24 Sgs-Thomson Microelectronics S.R.L. Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip
US5188277A (en) * 1989-12-28 1993-02-23 Electric Power Research Institute, Inc. Method of joining transformer coil conductors
US5492263A (en) * 1994-05-26 1996-02-20 Delco Electronics Corp. Method for wire bonding an aluminum wire to a lead of an electronics package
JP2013012727A (en) * 2011-06-28 2013-01-17 Samsung Electro-Mechanics Co Ltd Printed circuit board and method for manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942829A (en) * 1972-07-10 1974-04-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4942829A (en) * 1972-07-10 1974-04-22

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167234A (en) * 1984-09-10 1986-04-07 Matsushita Electric Ind Co Ltd Lead wire connecting method for hybrid integrated circuit
JPS6249640A (en) * 1985-08-29 1987-03-04 Mitsubishi Electric Corp Gold electrode structure
JPH0525176B2 (en) * 1985-08-29 1993-04-12 Mitsubishi Electric Corp
US4767049A (en) * 1986-05-19 1988-08-30 Olin Corporation Special surfaces for wire bonding
US5165590A (en) * 1989-09-21 1992-11-24 Sgs-Thomson Microelectronics S.R.L. Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip
US5188277A (en) * 1989-12-28 1993-02-23 Electric Power Research Institute, Inc. Method of joining transformer coil conductors
US5492263A (en) * 1994-05-26 1996-02-20 Delco Electronics Corp. Method for wire bonding an aluminum wire to a lead of an electronics package
JP2013012727A (en) * 2011-06-28 2013-01-17 Samsung Electro-Mechanics Co Ltd Printed circuit board and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JPS5435679A (en) Semiconductor connection method
JPS528785A (en) Semiconductor device electrode structure
JPS5434678A (en) Semiconductor device
JPS5287983A (en) Production of semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5348671A (en) Electrode structure of semiconductor element
JPS5422768A (en) Semiconductor device
JPS5413775A (en) Lead frame for semiconductor devices
JPS5419652A (en) Lead bonding method
JPS542069A (en) Semiconductor device
JPS5422171A (en) Manufacture of semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS53105969A (en) Manufacture of connection structure and wiring for semiconductor device
JPS5438766A (en) Ultrasonic wire bonding device
JPS547866A (en) Manufacture for semiconductor device
JPS5279657A (en) Wire bonding device
JPS54973A (en) Semiconductor element
JPS5318987A (en) Semiconductor device
JPS5422167A (en) Manufactuare of circuit block
JPS5396760A (en) Case for semiconductor device and production of the same
JPS5273675A (en) Structure of die bonding
JPS5299068A (en) Semiconductor device
JPS548834A (en) Semiconductor rectifying device
JPS542664A (en) Semiconductor device
JPS5396670A (en) Pellet bonding method