JPS5470056U - - Google Patents
Info
- Publication number
- JPS5470056U JPS5470056U JP1977144374U JP14437477U JPS5470056U JP S5470056 U JPS5470056 U JP S5470056U JP 1977144374 U JP1977144374 U JP 1977144374U JP 14437477 U JP14437477 U JP 14437477U JP S5470056 U JPS5470056 U JP S5470056U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977144374U JPS5470056U (ja) | 1977-10-27 | 1977-10-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1977144374U JPS5470056U (ja) | 1977-10-27 | 1977-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5470056U true JPS5470056U (ja) | 1979-05-18 |
Family
ID=29122927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1977144374U Pending JPS5470056U (ja) | 1977-10-27 | 1977-10-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5470056U (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57199228A (en) * | 1981-06-02 | 1982-12-07 | Toshiba Corp | Wire bonding pad device |
JPS60167286A (ja) * | 1984-02-10 | 1985-08-30 | キヤノン株式会社 | 電子デバイスにおける電気的接続部の構造 |
JPS6233490A (ja) * | 1985-08-06 | 1987-02-13 | 三菱電機株式会社 | 回路基板装置 |
JP2007335567A (ja) * | 2006-06-14 | 2007-12-27 | Fujikura Ltd | プリント配線板 |
WO2024116976A1 (ja) * | 2022-11-29 | 2024-06-06 | ソニーセミコンダクタソリューションズ株式会社 | コネクタ装置、半導体装置、基板間接続構造、および電子機器 |
-
1977
- 1977-10-27 JP JP1977144374U patent/JPS5470056U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57199228A (en) * | 1981-06-02 | 1982-12-07 | Toshiba Corp | Wire bonding pad device |
JPS6342853B2 (ja) * | 1981-06-02 | 1988-08-25 | Tokyo Shibaura Electric Co | |
JPS60167286A (ja) * | 1984-02-10 | 1985-08-30 | キヤノン株式会社 | 電子デバイスにおける電気的接続部の構造 |
JPS6233490A (ja) * | 1985-08-06 | 1987-02-13 | 三菱電機株式会社 | 回路基板装置 |
JP2007335567A (ja) * | 2006-06-14 | 2007-12-27 | Fujikura Ltd | プリント配線板 |
WO2024116976A1 (ja) * | 2022-11-29 | 2024-06-06 | ソニーセミコンダクタソリューションズ株式会社 | コネクタ装置、半導体装置、基板間接続構造、および電子機器 |