JPS5469048A - Elastic surface wave element - Google Patents
Elastic surface wave elementInfo
- Publication number
- JPS5469048A JPS5469048A JP13641877A JP13641877A JPS5469048A JP S5469048 A JPS5469048 A JP S5469048A JP 13641877 A JP13641877 A JP 13641877A JP 13641877 A JP13641877 A JP 13641877A JP S5469048 A JPS5469048 A JP S5469048A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- case
- adhesive
- inter
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
PURPOSE:To secure more perfect conductive performance on the back of the substrate by forming the metal film on the back of the substrate on the surface of which the inter-digital electrode is formed, and thus to increase the shielding effect as well as to enhance the side lobe of the frequency property. CONSTITUTION:Metal film (f) such as Al, Cu or the like is formed through the vacuum evaporation, spattering or plating means on the back of substrate (a), i.e., the adhesion side of the substrate to package case (b), and then attached to case (b) via conductive adhesive (e). This method features more perfect shielding effect in comparison with the conventional method in that the attachment is carried out only through adhesive (e). Then PZT of 0.5mm thick is used for substrate (a), and five pieces of 0.2mm grooves are provided (b) on the back of the inter-digital electrode. After this, the Cu film of 5000Angstrom is formed through the vacuum evaporation on the surfaces of the grooves and then adhered to case (b) via adhesive (b). Thus, the side lobe of frequency property 50 can be improved about 10dB in comparion with the conventionl one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13641877A JPS5469048A (en) | 1977-11-14 | 1977-11-14 | Elastic surface wave element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13641877A JPS5469048A (en) | 1977-11-14 | 1977-11-14 | Elastic surface wave element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5469048A true JPS5469048A (en) | 1979-06-02 |
Family
ID=15174683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13641877A Pending JPS5469048A (en) | 1977-11-14 | 1977-11-14 | Elastic surface wave element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5469048A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0088204A2 (en) * | 1982-01-11 | 1983-09-14 | Hitachi, Ltd. | Surface acoustic wave transmission device |
EP0224866A2 (en) * | 1985-12-05 | 1987-06-10 | Siemens Aktiengesellschaft | Surface acoustic wave circuit element |
KR20010062342A (en) * | 2000-12-12 | 2001-07-07 | 정성식 | The shape maintenance device of a shoes toe |
WO2011004665A1 (en) * | 2009-07-07 | 2011-01-13 | 株式会社村田製作所 | Elastic wave device and manufacturing method of elastic wave device |
US11082027B2 (en) | 2017-02-02 | 2021-08-03 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057360A (en) * | 1973-09-18 | 1975-05-19 | ||
JPS5057558A (en) * | 1973-09-19 | 1975-05-20 |
-
1977
- 1977-11-14 JP JP13641877A patent/JPS5469048A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057360A (en) * | 1973-09-18 | 1975-05-19 | ||
JPS5057558A (en) * | 1973-09-19 | 1975-05-20 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0088204A2 (en) * | 1982-01-11 | 1983-09-14 | Hitachi, Ltd. | Surface acoustic wave transmission device |
EP0224866A2 (en) * | 1985-12-05 | 1987-06-10 | Siemens Aktiengesellschaft | Surface acoustic wave circuit element |
KR20010062342A (en) * | 2000-12-12 | 2001-07-07 | 정성식 | The shape maintenance device of a shoes toe |
WO2011004665A1 (en) * | 2009-07-07 | 2011-01-13 | 株式会社村田製作所 | Elastic wave device and manufacturing method of elastic wave device |
JPWO2011004665A1 (en) * | 2009-07-07 | 2012-12-20 | 株式会社村田製作所 | Acoustic wave device and method of manufacturing acoustic wave device |
US8339015B2 (en) | 2009-07-07 | 2012-12-25 | Murata Manufacturing Co., Ltd. | Elastic wave device and method for manufacturing the same |
JP5637136B2 (en) * | 2009-07-07 | 2014-12-10 | 株式会社村田製作所 | Acoustic wave device and method of manufacturing acoustic wave device |
US11082027B2 (en) | 2017-02-02 | 2021-08-03 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
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