JPS5455270U - - Google Patents
Info
- Publication number
- JPS5455270U JPS5455270U JP1977129093U JP12909377U JPS5455270U JP S5455270 U JPS5455270 U JP S5455270U JP 1977129093 U JP1977129093 U JP 1977129093U JP 12909377 U JP12909377 U JP 12909377U JP S5455270 U JPS5455270 U JP S5455270U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977129093U JPS5910753Y2 (ja) | 1977-09-22 | 1977-09-22 | 半導体装置 |
| US06/190,744 US4300153A (en) | 1977-09-22 | 1980-09-25 | Flat shaped semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977129093U JPS5910753Y2 (ja) | 1977-09-22 | 1977-09-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5455270U true JPS5455270U (ja) | 1979-04-17 |
| JPS5910753Y2 JPS5910753Y2 (ja) | 1984-04-04 |
Family
ID=29093414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977129093U Expired JPS5910753Y2 (ja) | 1977-09-22 | 1977-09-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910753Y2 (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040165U (ja) * | 1973-08-10 | 1975-04-24 | ||
| JPS5074279U (ja) * | 1973-11-08 | 1975-06-28 | ||
| JPS5116877A (ja) * | 1974-07-31 | 1976-02-10 | Sharp Kk |
-
1977
- 1977-09-22 JP JP1977129093U patent/JPS5910753Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040165U (ja) * | 1973-08-10 | 1975-04-24 | ||
| JPS5074279U (ja) * | 1973-11-08 | 1975-06-28 | ||
| JPS5116877A (ja) * | 1974-07-31 | 1976-02-10 | Sharp Kk |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5910753Y2 (ja) | 1984-04-04 |