JPS5440569A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS5440569A JPS5440569A JP10745977A JP10745977A JPS5440569A JP S5440569 A JPS5440569 A JP S5440569A JP 10745977 A JP10745977 A JP 10745977A JP 10745977 A JP10745977 A JP 10745977A JP S5440569 A JPS5440569 A JP S5440569A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- holding
- pressure
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To make excellent contact by pressure-holding an semiconductor element by interposing oil or grease containing powdery metal between the main electrode of the element and an external electrode.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10745977A JPS5440569A (en) | 1977-09-06 | 1977-09-06 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10745977A JPS5440569A (en) | 1977-09-06 | 1977-09-06 | Semiconductor device and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5440569A true JPS5440569A (en) | 1979-03-30 |
Family
ID=14459702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10745977A Pending JPS5440569A (en) | 1977-09-06 | 1977-09-06 | Semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5440569A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225436A (en) * | 1984-04-23 | 1985-11-09 | Toshiba Corp | Molybdenum disc for semiconductor substrate |
US6072240A (en) * | 1998-10-16 | 2000-06-06 | Denso Corporation | Semiconductor chip package |
US6380622B1 (en) | 1998-11-09 | 2002-04-30 | Denso Corporation | Electric apparatus having a contact intermediary member and method for manufacturing the same |
US6538308B1 (en) | 1998-07-14 | 2003-03-25 | Denso Corporation | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
US6693350B2 (en) | 1999-11-24 | 2004-02-17 | Denso Corporation | Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure |
US6703707B1 (en) | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
US6946730B2 (en) | 2001-04-25 | 2005-09-20 | Denso Corporation | Semiconductor device having heat conducting plate |
-
1977
- 1977-09-06 JP JP10745977A patent/JPS5440569A/en active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225436A (en) * | 1984-04-23 | 1985-11-09 | Toshiba Corp | Molybdenum disc for semiconductor substrate |
US6538308B1 (en) | 1998-07-14 | 2003-03-25 | Denso Corporation | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
US7009284B2 (en) | 1998-07-14 | 2006-03-07 | Denso Corporation | Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element |
US6072240A (en) * | 1998-10-16 | 2000-06-06 | Denso Corporation | Semiconductor chip package |
US6448645B1 (en) | 1998-10-16 | 2002-09-10 | Denso Corporation | Semiconductor device |
US6380622B1 (en) | 1998-11-09 | 2002-04-30 | Denso Corporation | Electric apparatus having a contact intermediary member and method for manufacturing the same |
DE19951752B4 (en) * | 1998-11-09 | 2012-07-26 | Denso Corporation | Electric pressure contact device and method for its production |
US6891265B2 (en) | 1999-11-24 | 2005-05-10 | Denso Corporation | Semiconductor device having radiation structure |
US6798062B2 (en) | 1999-11-24 | 2004-09-28 | Denso Corporation | Semiconductor device having radiation structure |
US6960825B2 (en) | 1999-11-24 | 2005-11-01 | Denso Corporation | Semiconductor device having radiation structure |
US6967404B2 (en) | 1999-11-24 | 2005-11-22 | Denso Corporation | Semiconductor device having radiation structure |
US6992383B2 (en) | 1999-11-24 | 2006-01-31 | Denso Corporation | Semiconductor device having radiation structure |
US6998707B2 (en) | 1999-11-24 | 2006-02-14 | Denso Corporation | Semiconductor device having radiation structure |
US6703707B1 (en) | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
US6693350B2 (en) | 1999-11-24 | 2004-02-17 | Denso Corporation | Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure |
US6946730B2 (en) | 2001-04-25 | 2005-09-20 | Denso Corporation | Semiconductor device having heat conducting plate |
US6963133B2 (en) | 2001-04-25 | 2005-11-08 | Denso Corporation | Semiconductor device and method for manufacturing semiconductor device |
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