JPS5419660A - Method of packaging optical semiconductor resin mold - Google Patents

Method of packaging optical semiconductor resin mold

Info

Publication number
JPS5419660A
JPS5419660A JP8465277A JP8465277A JPS5419660A JP S5419660 A JPS5419660 A JP S5419660A JP 8465277 A JP8465277 A JP 8465277A JP 8465277 A JP8465277 A JP 8465277A JP S5419660 A JPS5419660 A JP S5419660A
Authority
JP
Japan
Prior art keywords
optical semiconductor
resin mold
semiconductor resin
packaging optical
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8465277A
Other languages
Japanese (ja)
Inventor
Osayuki Kobayashi
Hirotomo Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP8465277A priority Critical patent/JPS5419660A/en
Publication of JPS5419660A publication Critical patent/JPS5419660A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP8465277A 1977-07-15 1977-07-15 Method of packaging optical semiconductor resin mold Pending JPS5419660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8465277A JPS5419660A (en) 1977-07-15 1977-07-15 Method of packaging optical semiconductor resin mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8465277A JPS5419660A (en) 1977-07-15 1977-07-15 Method of packaging optical semiconductor resin mold

Publications (1)

Publication Number Publication Date
JPS5419660A true JPS5419660A (en) 1979-02-14

Family

ID=13836634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8465277A Pending JPS5419660A (en) 1977-07-15 1977-07-15 Method of packaging optical semiconductor resin mold

Country Status (1)

Country Link
JP (1) JPS5419660A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121782A (en) * 1983-12-06 1985-06-29 Nec Corp Light-emitting diode device
JPS60153538U (en) * 1984-03-22 1985-10-12 ロ−ム株式会社 semiconductor element
JPS60169677U (en) * 1984-04-19 1985-11-11 スタンレー電気株式会社 numeric display
JPH03119769A (en) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd Light-emitting module
JP2002324916A (en) * 2001-04-24 2002-11-08 Rohm Co Ltd Infrared data communication module and method of manufacturing the same
JP2003031848A (en) * 2001-07-13 2003-01-31 Seiwa Electric Mfg Co Ltd Solid-state light emitting lamp and its manufacturing method
JP2005056885A (en) * 2003-08-04 2005-03-03 Fine Rubber Kenkyusho:Kk Method of manufacturing semiconductor light emitting device
JP2005513817A (en) * 2001-12-24 2005-05-12 ジー・エル・アイ・グローバル・ライト・インダストリーズ・ゲーエム・ベーハー Method for manufacturing light-guided LED module in two steps divided in time
JP2006148147A (en) * 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Overmold lens on led die
JP2006237609A (en) * 2005-02-22 2006-09-07 Agilent Technol Inc Semiconductor light emitting device and method for manufacturing same
JP2008072102A (en) * 2006-08-21 2008-03-27 Cree Inc Method of forming semiconductor light emitting device package by liquid injection molding and molded semiconductor light emitting device strip
JP2008166782A (en) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd Light-emitting element
JP2011515120A (en) * 2008-03-14 2011-05-19 カルテンバッハ ウント ホイクト ゲゼルシャフト ミット ベシュレンクテル ハフツング Light source for dental instruments
JP2014135473A (en) * 2012-12-11 2014-07-24 Renesas Electronics Corp Optical coupling element

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121782A (en) * 1983-12-06 1985-06-29 Nec Corp Light-emitting diode device
JPH0325033B2 (en) * 1983-12-06 1991-04-04 Nippon Electric Co
JPS60153538U (en) * 1984-03-22 1985-10-12 ロ−ム株式会社 semiconductor element
JPS60169677U (en) * 1984-04-19 1985-11-11 スタンレー電気株式会社 numeric display
JPH03119769A (en) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd Light-emitting module
JP2002324916A (en) * 2001-04-24 2002-11-08 Rohm Co Ltd Infrared data communication module and method of manufacturing the same
JP2003031848A (en) * 2001-07-13 2003-01-31 Seiwa Electric Mfg Co Ltd Solid-state light emitting lamp and its manufacturing method
JP2005513817A (en) * 2001-12-24 2005-05-12 ジー・エル・アイ・グローバル・ライト・インダストリーズ・ゲーエム・ベーハー Method for manufacturing light-guided LED module in two steps divided in time
JP2005056885A (en) * 2003-08-04 2005-03-03 Fine Rubber Kenkyusho:Kk Method of manufacturing semiconductor light emitting device
US9081167B2 (en) 2004-11-15 2015-07-14 Koninklijke Philips N.V. Lens compression molded over LED die
JP2006148147A (en) * 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Overmold lens on led die
JP2014209665A (en) * 2004-11-15 2014-11-06 フィリップスルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Overmolded lens over led die
JP2006237609A (en) * 2005-02-22 2006-09-07 Agilent Technol Inc Semiconductor light emitting device and method for manufacturing same
US8778705B2 (en) 2005-02-22 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of manufacturing light emitting device
US9236537B2 (en) 2005-02-22 2016-01-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor light emitting device
KR101247426B1 (en) * 2005-02-22 2013-03-26 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 Semiconductor light emitting device and method of manufacture
JP2008072102A (en) * 2006-08-21 2008-03-27 Cree Inc Method of forming semiconductor light emitting device package by liquid injection molding and molded semiconductor light emitting device strip
US8410491B2 (en) 2006-08-21 2013-04-02 Cree, Inc. Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices
US8039848B2 (en) 2006-08-21 2011-10-18 Cree, Inc. Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices
JP2008166782A (en) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd Light-emitting element
US8569944B2 (en) 2006-12-26 2013-10-29 Seoul Semiconductor Co., Ltd. Light emitting device
US8405304B2 (en) 2006-12-26 2013-03-26 Seoul Semiconductor Co., Ltd. Light emtting device
JP2011515120A (en) * 2008-03-14 2011-05-19 カルテンバッハ ウント ホイクト ゲゼルシャフト ミット ベシュレンクテル ハフツング Light source for dental instruments
JP2014135473A (en) * 2012-12-11 2014-07-24 Renesas Electronics Corp Optical coupling element

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