JPS5419364A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5419364A
JPS5419364A JP8483277A JP8483277A JPS5419364A JP S5419364 A JPS5419364 A JP S5419364A JP 8483277 A JP8483277 A JP 8483277A JP 8483277 A JP8483277 A JP 8483277A JP S5419364 A JPS5419364 A JP S5419364A
Authority
JP
Japan
Prior art keywords
semiconductor device
interposing
soldering
stem
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8483277A
Other languages
Japanese (ja)
Inventor
Miezou Miyaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8483277A priority Critical patent/JPS5419364A/en
Publication of JPS5419364A publication Critical patent/JPS5419364A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent deterioration by thermal fatigue by soldering a substrate and stem by interposing a screen of Mo or W.
COPYRIGHT: (C)1979,JPO&Japio
JP8483277A 1977-07-14 1977-07-14 Semiconductor device Pending JPS5419364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8483277A JPS5419364A (en) 1977-07-14 1977-07-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8483277A JPS5419364A (en) 1977-07-14 1977-07-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5419364A true JPS5419364A (en) 1979-02-14

Family

ID=13841740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8483277A Pending JPS5419364A (en) 1977-07-14 1977-07-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5419364A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56125131A (en) * 1980-03-07 1981-10-01 Nec Corp Digital processing type transceiver for quadrature multiplex signal
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56125131A (en) * 1980-03-07 1981-10-01 Nec Corp Digital processing type transceiver for quadrature multiplex signal
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Similar Documents

Publication Publication Date Title
JPS548462A (en) Manufacture for semiconductor
JPS5419364A (en) Semiconductor device
JPS5380985A (en) Semiconductor device
JPS5314561A (en) Packaging device of semiconductor device
JPS5422163A (en) Semiconductor device
JPS5342659A (en) Semiconductor integrated circuit
JPS5425165A (en) Semiconductor device
JPS542069A (en) Semiconductor device
JPS5434755A (en) Manufacture of semiconductor device
JPS5432278A (en) Semiconductor device
JPS53145474A (en) Semiconductor device
JPS53142168A (en) Reproductive use of semiconductor substrate
JPS52141565A (en) Manufacture of semiconductor unit
JPS5434686A (en) Semiconductor device
JPS53144262A (en) Bonding unit for semiconductor device
JPS52143186A (en) Taping device
JPS5416980A (en) Semiconductor device
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS5399770A (en) Soft x-ray transfer mask
JPS54873A (en) Manufacture of semiconductor device
JPS548834A (en) Semiconductor rectifying device
JPS5397368A (en) Semiconductor device
JPS53121462A (en) Semiconductor device
JPS5427372A (en) Manufacture of semiconductor device
JPS5429564A (en) Stem for semiconductor device