JPS54162652A - Ring type solder and its manufacture - Google Patents
Ring type solder and its manufactureInfo
- Publication number
- JPS54162652A JPS54162652A JP7152178A JP7152178A JPS54162652A JP S54162652 A JPS54162652 A JP S54162652A JP 7152178 A JP7152178 A JP 7152178A JP 7152178 A JP7152178 A JP 7152178A JP S54162652 A JPS54162652 A JP S54162652A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ring type
- wire solder
- bending parts
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 9
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000005452 bending Methods 0.000 abstract 5
- 230000006835 compression Effects 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
Abstract
PURPOSE:To efficiently use the wire solder on purpose to reduce the manufacturing cost for the ring type solder, by bending the wire solder of specified length into a circular type, and by executing the compression forming into specified diameter and thickness. CONSTITUTION:A required amount of the wire solder 6 is fed while being pinched and collapsed by the drive roller 7 and the idle roller 8; at the same time, the cutting and bending parts 9 is moved down. The wire solder 6 is cut and bent into a horseshoe type between the semicircular concave 9b and the core metal. The left side bending parts 10 and the right side bending parts 11 are moved so as to form the horseshoe type wire solder into a ring type. The bending parts 10, 11, are moved back and the punch 13 is moved on purpose to execute the compression forming on the wire solder, which is bent into a ring type within the space being settled by the through hole 15a of the dies 15 and the end face 14a of the knockout sleeve 14; hereby, the junction is smoothed. According to this method, the easily handleable ring type solder without burr and edge can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7152178A JPS54162652A (en) | 1978-06-15 | 1978-06-15 | Ring type solder and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7152178A JPS54162652A (en) | 1978-06-15 | 1978-06-15 | Ring type solder and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54162652A true JPS54162652A (en) | 1979-12-24 |
Family
ID=13463102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7152178A Pending JPS54162652A (en) | 1978-06-15 | 1978-06-15 | Ring type solder and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54162652A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160869U (en) * | 1981-03-31 | 1982-10-08 | ||
JPS58194886U (en) * | 1982-06-17 | 1983-12-24 | 松下電器産業株式会社 | solder |
CN105127608A (en) * | 2015-10-15 | 2015-12-09 | 无锡日月合金材料有限公司 | Irregular soldering flake |
CN106271231A (en) * | 2016-08-31 | 2017-01-04 | 浙江永旺焊材制造有限公司 | A kind of preparation method of multi-turn solder ring |
CN108453196A (en) * | 2018-04-25 | 2018-08-28 | 晋江盾研机械设计有限公司 | One kind being exclusively used in iron ring extrusion formation equipment |
CN109093223A (en) * | 2018-09-26 | 2018-12-28 | 江苏天毅冷镦股份有限公司 | A kind of brazing solder automatic assembling machine |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137074A (en) * | 1974-07-24 | 1976-03-29 | Formflo Ltd |
-
1978
- 1978-06-15 JP JP7152178A patent/JPS54162652A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5137074A (en) * | 1974-07-24 | 1976-03-29 | Formflo Ltd |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160869U (en) * | 1981-03-31 | 1982-10-08 | ||
JPS6235599Y2 (en) * | 1981-03-31 | 1987-09-10 | ||
JPS58194886U (en) * | 1982-06-17 | 1983-12-24 | 松下電器産業株式会社 | solder |
CN105127608A (en) * | 2015-10-15 | 2015-12-09 | 无锡日月合金材料有限公司 | Irregular soldering flake |
CN106271231A (en) * | 2016-08-31 | 2017-01-04 | 浙江永旺焊材制造有限公司 | A kind of preparation method of multi-turn solder ring |
CN108453196A (en) * | 2018-04-25 | 2018-08-28 | 晋江盾研机械设计有限公司 | One kind being exclusively used in iron ring extrusion formation equipment |
CN109093223A (en) * | 2018-09-26 | 2018-12-28 | 江苏天毅冷镦股份有限公司 | A kind of brazing solder automatic assembling machine |
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