JPS54141564A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54141564A JPS54141564A JP4949978A JP4949978A JPS54141564A JP S54141564 A JPS54141564 A JP S54141564A JP 4949978 A JP4949978 A JP 4949978A JP 4949978 A JP4949978 A JP 4949978A JP S54141564 A JPS54141564 A JP S54141564A
- Authority
- JP
- Japan
- Prior art keywords
- package
- packaging
- terminal electrodes
- substrate
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent damages of terminals owing to the contact of foreign matter and the electrostatic breakdown of MOSICs by providing undulated form or through-hole form terminals to an IC package.
CONSTITUTION: A plurality of undulated form terminal electrodes 12 in which electrode connecting pins are insertable are provided to the back face 14 of the package substrate of an IC package. Packaging this IC package onto the substrate simply necessitates prior provision of pin form protrudions in a printed substrate or the like and insertion of the concave form or through-hole form terminal electrodes 12 of the IC package into said holes. This reduces the electrostatic breakdown of the elements prior to packaging because the terminal electrodes 12 are not protruding to the outside of the package and have less chances of making contact to external foreign matter. Even if undue force is generated at the time of packaging the IC package, all that occur is breakage of the pins of the printed substrate or the like and the damaging of the terminal electrode of the IC package will not occur.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4949978A JPS54141564A (en) | 1978-04-25 | 1978-04-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4949978A JPS54141564A (en) | 1978-04-25 | 1978-04-25 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54141564A true JPS54141564A (en) | 1979-11-02 |
JPS639379B2 JPS639379B2 (en) | 1988-02-29 |
Family
ID=12832826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4949978A Granted JPS54141564A (en) | 1978-04-25 | 1978-04-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54141564A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6033936A (en) * | 1997-10-28 | 2000-03-07 | Nec Corporation | Method of mounting an LSI package |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4875566U (en) * | 1971-12-20 | 1973-09-19 | ||
JPS5099452U (en) * | 1974-01-16 | 1975-08-18 | ||
JPS5154260A (en) * | 1974-11-07 | 1976-05-13 | Ngk Spark Plug Co | |
JPS53763U (en) * | 1976-06-23 | 1978-01-06 | ||
JPS537150U (en) * | 1976-07-05 | 1978-01-21 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53763B2 (en) * | 1973-03-28 | 1978-01-12 | ||
JPS537150B2 (en) * | 1973-12-20 | 1978-03-15 |
-
1978
- 1978-04-25 JP JP4949978A patent/JPS54141564A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4875566U (en) * | 1971-12-20 | 1973-09-19 | ||
JPS5099452U (en) * | 1974-01-16 | 1975-08-18 | ||
JPS5154260A (en) * | 1974-11-07 | 1976-05-13 | Ngk Spark Plug Co | |
JPS53763U (en) * | 1976-06-23 | 1978-01-06 | ||
JPS537150U (en) * | 1976-07-05 | 1978-01-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6033936A (en) * | 1997-10-28 | 2000-03-07 | Nec Corporation | Method of mounting an LSI package |
Also Published As
Publication number | Publication date |
---|---|
JPS639379B2 (en) | 1988-02-29 |
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