JPS54141564A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54141564A
JPS54141564A JP4949978A JP4949978A JPS54141564A JP S54141564 A JPS54141564 A JP S54141564A JP 4949978 A JP4949978 A JP 4949978A JP 4949978 A JP4949978 A JP 4949978A JP S54141564 A JPS54141564 A JP S54141564A
Authority
JP
Japan
Prior art keywords
package
packaging
terminal electrodes
substrate
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4949978A
Other languages
Japanese (ja)
Other versions
JPS639379B2 (en
Inventor
Hiroaki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4949978A priority Critical patent/JPS54141564A/en
Publication of JPS54141564A publication Critical patent/JPS54141564A/en
Publication of JPS639379B2 publication Critical patent/JPS639379B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent damages of terminals owing to the contact of foreign matter and the electrostatic breakdown of MOSICs by providing undulated form or through-hole form terminals to an IC package.
CONSTITUTION: A plurality of undulated form terminal electrodes 12 in which electrode connecting pins are insertable are provided to the back face 14 of the package substrate of an IC package. Packaging this IC package onto the substrate simply necessitates prior provision of pin form protrudions in a printed substrate or the like and insertion of the concave form or through-hole form terminal electrodes 12 of the IC package into said holes. This reduces the electrostatic breakdown of the elements prior to packaging because the terminal electrodes 12 are not protruding to the outside of the package and have less chances of making contact to external foreign matter. Even if undue force is generated at the time of packaging the IC package, all that occur is breakage of the pins of the printed substrate or the like and the damaging of the terminal electrode of the IC package will not occur.
COPYRIGHT: (C)1979,JPO&Japio
JP4949978A 1978-04-25 1978-04-25 Semiconductor device Granted JPS54141564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4949978A JPS54141564A (en) 1978-04-25 1978-04-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4949978A JPS54141564A (en) 1978-04-25 1978-04-25 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54141564A true JPS54141564A (en) 1979-11-02
JPS639379B2 JPS639379B2 (en) 1988-02-29

Family

ID=12832826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4949978A Granted JPS54141564A (en) 1978-04-25 1978-04-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54141564A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033936A (en) * 1997-10-28 2000-03-07 Nec Corporation Method of mounting an LSI package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875566U (en) * 1971-12-20 1973-09-19
JPS5099452U (en) * 1974-01-16 1975-08-18
JPS5154260A (en) * 1974-11-07 1976-05-13 Ngk Spark Plug Co
JPS53763U (en) * 1976-06-23 1978-01-06
JPS537150U (en) * 1976-07-05 1978-01-21

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53763B2 (en) * 1973-03-28 1978-01-12
JPS537150B2 (en) * 1973-12-20 1978-03-15

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875566U (en) * 1971-12-20 1973-09-19
JPS5099452U (en) * 1974-01-16 1975-08-18
JPS5154260A (en) * 1974-11-07 1976-05-13 Ngk Spark Plug Co
JPS53763U (en) * 1976-06-23 1978-01-06
JPS537150U (en) * 1976-07-05 1978-01-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033936A (en) * 1997-10-28 2000-03-07 Nec Corporation Method of mounting an LSI package

Also Published As

Publication number Publication date
JPS639379B2 (en) 1988-02-29

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