JPS54132661A - Transfer molding of thermosetting resin - Google Patents
Transfer molding of thermosetting resinInfo
- Publication number
- JPS54132661A JPS54132661A JP4023178A JP4023178A JPS54132661A JP S54132661 A JPS54132661 A JP S54132661A JP 4023178 A JP4023178 A JP 4023178A JP 4023178 A JP4023178 A JP 4023178A JP S54132661 A JPS54132661 A JP S54132661A
- Authority
- JP
- Japan
- Prior art keywords
- transfer molding
- plunger
- coated
- molding machine
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent the abrasion of the plunger of a transfer molding machine, and to prevent the burr of the transfer molded article, by using a transfer molding machine having a plunger coated its sliding surface to the sleeve with a specific hardened film. CONSTITUTION:The plunger 7 of a transfer molding machine is coated with a coating composition prepared by dispersing organic or inorganic fine powder having lubricating action, e.g. Teflon, molybdenum disulfide, graphite, etc., in a mixture of a thermosetting resin and a solvent, and cured to form a cured film 15. A molten resin 6 is molded using the coated plunger 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4023178A JPS54132661A (en) | 1978-04-07 | 1978-04-07 | Transfer molding of thermosetting resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4023178A JPS54132661A (en) | 1978-04-07 | 1978-04-07 | Transfer molding of thermosetting resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54132661A true JPS54132661A (en) | 1979-10-15 |
Family
ID=12574950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4023178A Pending JPS54132661A (en) | 1978-04-07 | 1978-04-07 | Transfer molding of thermosetting resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54132661A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864426U (en) * | 1981-10-28 | 1983-04-30 | 日本電気株式会社 | Transfer resin molding equipment |
JPS62206842A (en) * | 1986-03-07 | 1987-09-11 | Shin Etsu Chem Co Ltd | Transfer molding machine for resin seal type semiconductor device |
US8029720B2 (en) * | 2005-11-25 | 2011-10-04 | Dai-Ichi Seiko Co., Ltd. | Resin sealing apparatus and resin sealing method |
CN103786319A (en) * | 2012-10-31 | 2014-05-14 | 山田尖端科技株式会社 | Plunger, resin molding machine and method of resin molding |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51140842A (en) * | 1975-05-16 | 1976-12-04 | M & T Chemicals Inc | Bright nickelliron plating |
-
1978
- 1978-04-07 JP JP4023178A patent/JPS54132661A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51140842A (en) * | 1975-05-16 | 1976-12-04 | M & T Chemicals Inc | Bright nickelliron plating |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864426U (en) * | 1981-10-28 | 1983-04-30 | 日本電気株式会社 | Transfer resin molding equipment |
JPS6339053Y2 (en) * | 1981-10-28 | 1988-10-14 | ||
JPS62206842A (en) * | 1986-03-07 | 1987-09-11 | Shin Etsu Chem Co Ltd | Transfer molding machine for resin seal type semiconductor device |
JPH0416015B2 (en) * | 1986-03-07 | 1992-03-19 | Shinetsu Chem Ind Co | |
US8029720B2 (en) * | 2005-11-25 | 2011-10-04 | Dai-Ichi Seiko Co., Ltd. | Resin sealing apparatus and resin sealing method |
CN103786319A (en) * | 2012-10-31 | 2014-05-14 | 山田尖端科技株式会社 | Plunger, resin molding machine and method of resin molding |
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