JPS54117328A - Electroless plating method for polymeric material - Google Patents

Electroless plating method for polymeric material

Info

Publication number
JPS54117328A
JPS54117328A JP2487478A JP2487478A JPS54117328A JP S54117328 A JPS54117328 A JP S54117328A JP 2487478 A JP2487478 A JP 2487478A JP 2487478 A JP2487478 A JP 2487478A JP S54117328 A JPS54117328 A JP S54117328A
Authority
JP
Japan
Prior art keywords
polymeric material
soln
electroless plating
plating method
chemically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2487478A
Other languages
Japanese (ja)
Inventor
Susumu Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2487478A priority Critical patent/JPS54117328A/en
Publication of JPS54117328A publication Critical patent/JPS54117328A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching

Abstract

PURPOSE:To enhance the adhering strength of an electroless plated layer formed on the surface of a polymeric material by chemically roughening the surface with an aq. soln. of potassium permanganate contg. a persulfate added. CONSTITUTION:The surface of a polymeric material such as ABS resin, AS resin, polypropylene or nitrile type rubber is chemically roughened with an aq. soln. contg. 0.5-5.0 wt% of KMnO4 and 1.0-50 wt% of a persulfate such as (NH4)2S2O8, Na2S2O8 or K2S2O8 as a chemically roughening soln. The roughened material is then electroless plated with Cu, Ni, etc. The resulting plated layer has such a high adhering strength as above 2 kg/cm<2> to the polymeric material.
JP2487478A 1978-03-03 1978-03-03 Electroless plating method for polymeric material Pending JPS54117328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2487478A JPS54117328A (en) 1978-03-03 1978-03-03 Electroless plating method for polymeric material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2487478A JPS54117328A (en) 1978-03-03 1978-03-03 Electroless plating method for polymeric material

Publications (1)

Publication Number Publication Date
JPS54117328A true JPS54117328A (en) 1979-09-12

Family

ID=12150340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2487478A Pending JPS54117328A (en) 1978-03-03 1978-03-03 Electroless plating method for polymeric material

Country Status (1)

Country Link
JP (1) JPS54117328A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
EP2009142A1 (en) * 2006-04-18 2008-12-31 Okuno Chemical Industries Co. Ltd Composition for etching treatment of resin molded article

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
EP2009142A1 (en) * 2006-04-18 2008-12-31 Okuno Chemical Industries Co. Ltd Composition for etching treatment of resin molded article
US20090092757A1 (en) * 2006-04-18 2009-04-09 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin molded article
EP2009142A4 (en) * 2006-04-18 2010-08-11 Okuno Chem Ind Co Composition for etching treatment of resin molded article
US8394289B2 (en) 2006-04-18 2013-03-12 Okuno Chemicals Industries Co., Ltd. Composition for etching treatment of resin molded article

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