JPS53119228A - Production of perforated plated metal foil - Google Patents
Production of perforated plated metal foilInfo
- Publication number
- JPS53119228A JPS53119228A JP3505477A JP3505477A JPS53119228A JP S53119228 A JPS53119228 A JP S53119228A JP 3505477 A JP3505477 A JP 3505477A JP 3505477 A JP3505477 A JP 3505477A JP S53119228 A JPS53119228 A JP S53119228A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- plated metal
- production
- perforated
- perforated plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To produce a plated metal foil with a perforated pattern by forming a resist film with a predetermined pattern on the surface of a water premeable substrate and carrying out plating while the resist film of the resulting non-electroconductive masking material for plating is closely contacted with the surface of a cathode.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3505477A JPS53119228A (en) | 1977-03-29 | 1977-03-29 | Production of perforated plated metal foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3505477A JPS53119228A (en) | 1977-03-29 | 1977-03-29 | Production of perforated plated metal foil |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53119228A true JPS53119228A (en) | 1978-10-18 |
JPS579438B2 JPS579438B2 (en) | 1982-02-22 |
Family
ID=12431314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3505477A Granted JPS53119228A (en) | 1977-03-29 | 1977-03-29 | Production of perforated plated metal foil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53119228A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
CN111850628A (en) * | 2020-06-12 | 2020-10-30 | 九江德福科技股份有限公司 | Method for manufacturing punched copper foil of shielding cathode plate |
-
1977
- 1977-03-29 JP JP3505477A patent/JPS53119228A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
CN111850628A (en) * | 2020-06-12 | 2020-10-30 | 九江德福科技股份有限公司 | Method for manufacturing punched copper foil of shielding cathode plate |
Also Published As
Publication number | Publication date |
---|---|
JPS579438B2 (en) | 1982-02-22 |
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