JPS54111281A - Resin seal forming mold of semiconductor device - Google Patents

Resin seal forming mold of semiconductor device

Info

Publication number
JPS54111281A
JPS54111281A JP1886178A JP1886178A JPS54111281A JP S54111281 A JPS54111281 A JP S54111281A JP 1886178 A JP1886178 A JP 1886178A JP 1886178 A JP1886178 A JP 1886178A JP S54111281 A JPS54111281 A JP S54111281A
Authority
JP
Japan
Prior art keywords
mold
heat sink
resin
lower mold
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1886178A
Other languages
Japanese (ja)
Other versions
JPS5625779B2 (en
Inventor
Yutaka Morita
Isamu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1886178A priority Critical patent/JPS54111281A/en
Publication of JPS54111281A publication Critical patent/JPS54111281A/en
Publication of JPS5625779B2 publication Critical patent/JPS5625779B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent resin from adhering to a heat sink by providing a adsorption means, which adsorbs resin, on the wall face, where the heat sink of a resin seal forming seal forming mold is brought into contact, through gum packing.
CONSTITUTION: IC element 5 is fixed to heat sink 4, and heat sink 4 is put on gum packing 15 is lower mold 9b while one end 1a of conductive stripe 2 connected to element 5 is protruded outside a metallic mold. Next, upper mold 9a is put on lower mold 9b to seal element 5 hermetically, and the metallic mold is heated at a prescribed temperature, and vacuum suction entrance 13 provided in lower mold 9b is used to make the inside of the metallic mold vacuum. After that, high-pressure resin 10 is injected into space part 9c in the metallic mold, and vacuum adsorption is released to open upper mold 9a and lower mold 9b after a prescribed time, and compressed air is sent from suction entrance 13 to remove element 5 from the metallic mold. As a result, the interval between lower face 4b of heat sink 4 and internal bottom face 9d of lower mold 9b can be made several μm, and resin can be prevented from invading this interval.
COPYRIGHT: (C)1979,JPO&Japio
JP1886178A 1978-02-20 1978-02-20 Resin seal forming mold of semiconductor device Granted JPS54111281A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1886178A JPS54111281A (en) 1978-02-20 1978-02-20 Resin seal forming mold of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1886178A JPS54111281A (en) 1978-02-20 1978-02-20 Resin seal forming mold of semiconductor device

Publications (2)

Publication Number Publication Date
JPS54111281A true JPS54111281A (en) 1979-08-31
JPS5625779B2 JPS5625779B2 (en) 1981-06-15

Family

ID=11983313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1886178A Granted JPS54111281A (en) 1978-02-20 1978-02-20 Resin seal forming mold of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54111281A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397370A (en) * 1977-02-07 1978-08-25 Toshiba Corp Trasfer mold device for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397370A (en) * 1977-02-07 1978-08-25 Toshiba Corp Trasfer mold device for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

Also Published As

Publication number Publication date
JPS5625779B2 (en) 1981-06-15

Similar Documents

Publication Publication Date Title
JPS5435679A (en) Semiconductor connection method
JPS54111281A (en) Resin seal forming mold of semiconductor device
JPS5415663A (en) Semiconductor device
JPS5372456A (en) Glass sealing semiconductor device
JPS53108369A (en) Electronic components
JPS5433665A (en) Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JPS546169A (en) Production of insulative pannel
JPS5559745A (en) Semiconductor device
JPS537173A (en) Solder-sealed ceramic package
JPS57198649A (en) Semiconductor device
JPS5216166A (en) Semiconductor device
JPS5514286A (en) Sulfurizing metallic mold for recovery tire
SE8107881L (en) DEVICE FOR CLASSIFICATION OF AN ELECTRIC CONDENSOR IN A HEARDABLE RESIN
JPS5460564A (en) Resin mold semiconductor device
JPS5449070A (en) Container for semiconductor device
JPS5210676A (en) Semiconductor device
JPS52142968A (en) Assembling method of semiconductor devices
JPS5591837A (en) Manufacture of electronic device
JPS51117575A (en) Electronic circuit and its manufacturing method
JPS52132671A (en) Enclosing method of mercury for discharge tube
JPS5515265A (en) Collet for assembling semiconductor device
JPS5624960A (en) Lead frame for semiconductor device
JPS5476062A (en) Manufactre of semiconductor device
JPS5320860A (en) Hermetic sealing method of electronic parts
JPS5541706A (en) Semiconductor device