JPS537173A - Solder-sealed ceramic package - Google Patents

Solder-sealed ceramic package

Info

Publication number
JPS537173A
JPS537173A JP8085676A JP8085676A JPS537173A JP S537173 A JPS537173 A JP S537173A JP 8085676 A JP8085676 A JP 8085676A JP 8085676 A JP8085676 A JP 8085676A JP S537173 A JPS537173 A JP S537173A
Authority
JP
Japan
Prior art keywords
solder
ceramic package
sealed ceramic
package body
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8085676A
Other languages
Japanese (ja)
Other versions
JPS5538057B2 (en
Inventor
Kaneichi Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8085676A priority Critical patent/JPS537173A/en
Publication of JPS537173A publication Critical patent/JPS537173A/en
Publication of JPS5538057B2 publication Critical patent/JPS5538057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE: Diffusion of solder into package body at the time of sealing operation is prevented by beforehand providing a non-metallized region on one or both of the bonding surfaces of a ceramic package body or cover.
COPYRIGHT: (C)1978,JPO&Japio
JP8085676A 1976-07-09 1976-07-09 Solder-sealed ceramic package Granted JPS537173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8085676A JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8085676A JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Publications (2)

Publication Number Publication Date
JPS537173A true JPS537173A (en) 1978-01-23
JPS5538057B2 JPS5538057B2 (en) 1980-10-02

Family

ID=13729977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8085676A Granted JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Country Status (1)

Country Link
JP (1) JPS537173A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852858A (en) * 1981-09-24 1983-03-29 Nec Corp Semiconductor device
JP2007202095A (en) * 2005-12-28 2007-08-09 Kyocera Kinseki Corp Piezoelectric device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142916U (en) * 1985-02-25 1986-09-03

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831511A (en) * 1971-08-26 1973-04-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831511A (en) * 1971-08-26 1973-04-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852858A (en) * 1981-09-24 1983-03-29 Nec Corp Semiconductor device
JP2007202095A (en) * 2005-12-28 2007-08-09 Kyocera Kinseki Corp Piezoelectric device

Also Published As

Publication number Publication date
JPS5538057B2 (en) 1980-10-02

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