JPS5382261A - Semiconductor wafer dicing method - Google Patents

Semiconductor wafer dicing method

Info

Publication number
JPS5382261A
JPS5382261A JP15854576A JP15854576A JPS5382261A JP S5382261 A JPS5382261 A JP S5382261A JP 15854576 A JP15854576 A JP 15854576A JP 15854576 A JP15854576 A JP 15854576A JP S5382261 A JPS5382261 A JP S5382261A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
dicing method
wafer dicing
grooves
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15854576A
Other languages
Japanese (ja)
Inventor
Takashi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP15854576A priority Critical patent/JPS5382261A/en
Publication of JPS5382261A publication Critical patent/JPS5382261A/en
Pending legal-status Critical Current

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Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To facilitate mounting of chips and shorten case accommodating time by cutting parallel grooves on a semiconductor wafer and scribing the wafer in a direction perpendicular to the grooves thereby forming rectangular strip form chip groups.
COPYRIGHT: (C)1978,JPO&Japio
JP15854576A 1976-12-28 1976-12-28 Semiconductor wafer dicing method Pending JPS5382261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15854576A JPS5382261A (en) 1976-12-28 1976-12-28 Semiconductor wafer dicing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15854576A JPS5382261A (en) 1976-12-28 1976-12-28 Semiconductor wafer dicing method

Publications (1)

Publication Number Publication Date
JPS5382261A true JPS5382261A (en) 1978-07-20

Family

ID=15674038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15854576A Pending JPS5382261A (en) 1976-12-28 1976-12-28 Semiconductor wafer dicing method

Country Status (1)

Country Link
JP (1) JPS5382261A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023013146A1 (en) * 2021-08-03 2023-02-09 Ｔｏｗａ株式会社 Processing device and processed object manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023013146A1 (en) * 2021-08-03 2023-02-09 Ｔｏｗａ株式会社 Processing device and processed object manufacturing method
TWI830259B (en) * 2021-08-03 2024-01-21 日商Ｔｏｗａ股份有限公司 Processing device and method of manufacturing processed product

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