JPS5380979A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5380979A
JPS5380979A JP15623076A JP15623076A JPS5380979A JP S5380979 A JPS5380979 A JP S5380979A JP 15623076 A JP15623076 A JP 15623076A JP 15623076 A JP15623076 A JP 15623076A JP S5380979 A JPS5380979 A JP S5380979A
Authority
JP
Japan
Prior art keywords
semiconductor device
support panel
theaanode
concavity
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15623076A
Other languages
Japanese (ja)
Inventor
Isamu Tsuji
Yasumasa Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15623076A priority Critical patent/JPS5380979A/en
Publication of JPS5380979A publication Critical patent/JPS5380979A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To improve the positioning accuracy for the element center by making concave theaanode terminal plate touching the anode support panel and inserting the support panel into the concavity.
JP15623076A 1976-12-27 1976-12-27 Semiconductor device Pending JPS5380979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15623076A JPS5380979A (en) 1976-12-27 1976-12-27 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15623076A JPS5380979A (en) 1976-12-27 1976-12-27 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5380979A true JPS5380979A (en) 1978-07-17

Family

ID=15623199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15623076A Pending JPS5380979A (en) 1976-12-27 1976-12-27 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5380979A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135161A (en) * 1984-12-06 1986-06-23 Internatl Rectifier Corp Japan Ltd Manufacture of semiconductor device
JPS6337660A (en) * 1986-07-30 1988-02-18 ビ−ビ−シ−　ブラウン　ボヴエリ　アクチエンゲゼルシヤフト Pressurized contact type gto thyristor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135161A (en) * 1984-12-06 1986-06-23 Internatl Rectifier Corp Japan Ltd Manufacture of semiconductor device
JPS6337660A (en) * 1986-07-30 1988-02-18 ビ−ビ−シ−　ブラウン　ボヴエリ　アクチエンゲゼルシヤフト Pressurized contact type gto thyristor

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