JPS536756B2 - - Google Patents
Info
- Publication number
- JPS536756B2 JPS536756B2 JP5229674A JP5229674A JPS536756B2 JP S536756 B2 JPS536756 B2 JP S536756B2 JP 5229674 A JP5229674 A JP 5229674A JP 5229674 A JP5229674 A JP 5229674A JP S536756 B2 JPS536756 B2 JP S536756B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5229674A JPS536756B2 (ja) | 1974-05-13 | 1974-05-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5229674A JPS536756B2 (ja) | 1974-05-13 | 1974-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50144987A JPS50144987A (ja) | 1975-11-21 |
JPS536756B2 true JPS536756B2 (ja) | 1978-03-10 |
Family
ID=12910825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5229674A Expired JPS536756B2 (ja) | 1974-05-13 | 1974-05-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS536756B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002150548A (ja) * | 2000-11-09 | 2002-05-24 | Hoya Corp | 情報記録媒体用ガラス基板の製造方法及び情報記録媒体の製造方法 |
JP2005103684A (ja) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | コロイド分散型ラッピング剤及びその製造方法 |
JP2005105068A (ja) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | ラッピングスラリー及びウェーハの加工方法 |
JP2007036270A (ja) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
CN108949036A (zh) * | 2018-09-06 | 2018-12-07 | 北京保利世达科技有限公司 | 一种抛光液及对碳化硅晶体的抛光方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5281692A (en) * | 1975-12-28 | 1977-07-08 | Fujimi Kenmazai Kougiyou Kk | Method of grinding general metallic materials and composites for grinding |
DE2722780A1 (de) * | 1977-05-20 | 1978-11-23 | Wacker Chemitronic | Laepptrennmittel |
-
1974
- 1974-05-13 JP JP5229674A patent/JPS536756B2/ja not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007036270A (ja) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
JP2007036271A (ja) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤および基板の研磨法 |
JP2002150548A (ja) * | 2000-11-09 | 2002-05-24 | Hoya Corp | 情報記録媒体用ガラス基板の製造方法及び情報記録媒体の製造方法 |
JP4562274B2 (ja) * | 2000-11-09 | 2010-10-13 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法及び情報記録媒体の製造方法 |
JP2005103684A (ja) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | コロイド分散型ラッピング剤及びその製造方法 |
JP2005105068A (ja) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | ラッピングスラリー及びウェーハの加工方法 |
CN108949036A (zh) * | 2018-09-06 | 2018-12-07 | 北京保利世达科技有限公司 | 一种抛光液及对碳化硅晶体的抛光方法 |
CN108949036B (zh) * | 2018-09-06 | 2021-01-05 | 北京保利世达科技有限公司 | 一种抛光液及对碳化硅晶体的抛光方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS50144987A (ja) | 1975-11-21 |