JPS5346279A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5346279A
JPS5346279A JP12154676A JP12154676A JPS5346279A JP S5346279 A JPS5346279 A JP S5346279A JP 12154676 A JP12154676 A JP 12154676A JP 12154676 A JP12154676 A JP 12154676A JP S5346279 A JPS5346279 A JP S5346279A
Authority
JP
Japan
Prior art keywords
semiconductor device
production
semiconductor elements
facilitate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12154676A
Other languages
Japanese (ja)
Other versions
JPS5712537B2 (en
Inventor
Hiroaki Fujimoto
Masaharu Noyori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12154676A priority Critical patent/JPS5346279A/en
Publication of JPS5346279A publication Critical patent/JPS5346279A/en
Publication of JPS5712537B2 publication Critical patent/JPS5712537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To facilitate position alignment of the electrodes of semiconductor elements and the holes of a heat resistant insulating substrate and facilitate the assembling of a minute semiconductor device such as IC by beforehand providing locating recesses in a bonding layer for bonding and fixing of the semiconductor elements.
COPYRIGHT: (C)1978,JPO&Japio
JP12154676A 1976-10-08 1976-10-08 Production of semiconductor device Granted JPS5346279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12154676A JPS5346279A (en) 1976-10-08 1976-10-08 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12154676A JPS5346279A (en) 1976-10-08 1976-10-08 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5346279A true JPS5346279A (en) 1978-04-25
JPS5712537B2 JPS5712537B2 (en) 1982-03-11

Family

ID=14813913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12154676A Granted JPS5346279A (en) 1976-10-08 1976-10-08 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5346279A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144967A (en) * 1978-05-04 1979-11-12 Matsushita Electric Ind Co Ltd Electronic circuit apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144967A (en) * 1978-05-04 1979-11-12 Matsushita Electric Ind Co Ltd Electronic circuit apparatus

Also Published As

Publication number Publication date
JPS5712537B2 (en) 1982-03-11

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