JPS5339068A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5339068A
JPS5339068A JP11313176A JP11313176A JPS5339068A JP S5339068 A JPS5339068 A JP S5339068A JP 11313176 A JP11313176 A JP 11313176A JP 11313176 A JP11313176 A JP 11313176A JP S5339068 A JPS5339068 A JP S5339068A
Authority
JP
Japan
Prior art keywords
pellets
semiconductor device
electrodes
area
multilayers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11313176A
Other languages
Japanese (ja)
Inventor
Yoshiharu Nagayama
Akihiro Kenmochi
Kazuo Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11313176A priority Critical patent/JPS5339068A/en
Publication of JPS5339068A publication Critical patent/JPS5339068A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To make possible packaging of pellets of a relatively large size in a small space and increase density by providing spherical electrodes between pellets and connecting the pellets by way of these electrodes in superposing in multilayers semiconductor pellets of a large area and a small area or crossed rectangular pellets and connecting these pellets.
COPYRIGHT: (C)1978,JPO&Japio
JP11313176A 1976-09-22 1976-09-22 Semiconductor device Pending JPS5339068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11313176A JPS5339068A (en) 1976-09-22 1976-09-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11313176A JPS5339068A (en) 1976-09-22 1976-09-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5339068A true JPS5339068A (en) 1978-04-10

Family

ID=14604321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11313176A Pending JPS5339068A (en) 1976-09-22 1976-09-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5339068A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS56158467A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Semiconductor device
JPS57145367A (en) * 1981-03-03 1982-09-08 Mitsubishi Electric Corp Three-dimensional semiconductor device
JPS58154254A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Semiconductor device
JPS59229850A (en) * 1983-05-16 1984-12-24 Rohm Co Ltd Semiconductor device
JPS60150660A (en) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp Semiconductor device
JPH02110349U (en) * 1989-02-21 1990-09-04
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7436071B2 (en) 1997-03-10 2008-10-14 Seiko Epson Corporation Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
JP2010239162A (en) * 2010-07-26 2010-10-21 Oki Semiconductor Co Ltd Semiconductor device and method of manufacturing the same

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS56158467A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Semiconductor device
JPS6239820B2 (en) * 1980-05-12 1987-08-25 Mitsubishi Electric Corp
JPS57145367A (en) * 1981-03-03 1982-09-08 Mitsubishi Electric Corp Three-dimensional semiconductor device
JPS58154254A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Semiconductor device
JPS59229850A (en) * 1983-05-16 1984-12-24 Rohm Co Ltd Semiconductor device
JPS60150660A (en) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp Semiconductor device
JPH02110349U (en) * 1989-02-21 1990-09-04
US7436071B2 (en) 1997-03-10 2008-10-14 Seiko Epson Corporation Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
US8134237B2 (en) 1997-03-10 2012-03-13 Seiko Epson Corporation Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
US7932612B2 (en) 1997-03-10 2011-04-26 Seiko Epson Corporation Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
US7598619B2 (en) 1997-03-10 2009-10-06 Seiko Epson Corporation Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6452260B1 (en) 1997-09-02 2002-09-17 Silicon Light Machines Electrical interface to integrated circuit device having high density I/O count
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
JP2010239162A (en) * 2010-07-26 2010-10-21 Oki Semiconductor Co Ltd Semiconductor device and method of manufacturing the same

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