JPS5316099A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS5316099A
JPS5316099A JP9066376A JP9066376A JPS5316099A JP S5316099 A JPS5316099 A JP S5316099A JP 9066376 A JP9066376 A JP 9066376A JP 9066376 A JP9066376 A JP 9066376A JP S5316099 A JPS5316099 A JP S5316099A
Authority
JP
Japan
Prior art keywords
resin composition
heat
resistant resin
mecahnical
adherability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9066376A
Other languages
Japanese (ja)
Other versions
JPS5817488B2 (en
Inventor
Akira Fukami
Hiroyuki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9066376A priority Critical patent/JPS5817488B2/en
Publication of JPS5316099A publication Critical patent/JPS5316099A/en
Publication of JPS5817488B2 publication Critical patent/JPS5817488B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A resin composition having low shrinkage, good heat resistance, mecahnical properties, and adherability, which is prepared by incorporating a specific maleimide and a phenoxy resin to a mixture of an epoxy compound a curing agent.
COPYRIGHT: (C)1978,JPO&Japio
JP9066376A 1976-07-28 1976-07-28 Heat resistant resin composition Expired JPS5817488B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9066376A JPS5817488B2 (en) 1976-07-28 1976-07-28 Heat resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9066376A JPS5817488B2 (en) 1976-07-28 1976-07-28 Heat resistant resin composition

Publications (2)

Publication Number Publication Date
JPS5316099A true JPS5316099A (en) 1978-02-14
JPS5817488B2 JPS5817488B2 (en) 1983-04-07

Family

ID=14004762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9066376A Expired JPS5817488B2 (en) 1976-07-28 1976-07-28 Heat resistant resin composition

Country Status (1)

Country Link
JP (1) JPS5817488B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143320A (en) * 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
JPS63251418A (en) * 1987-04-07 1988-10-18 Toshiba Chem Corp Curable composition
JPS63251417A (en) * 1987-04-07 1988-10-18 Toshiba Chem Corp Heat-resistant resin composition
CN102391810A (en) * 2011-09-19 2012-03-28 湖南神力铃胶粘剂制造有限公司 Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof
JP2012116954A (en) * 2010-12-01 2012-06-21 Hitachi Cable Ltd Adhesive composition, adhesive film and wiring film using the same
JP2017110135A (en) * 2015-12-17 2017-06-22 株式会社日立産機システム Mold varnish, resin cured product, power apparatus, and vacuum circuit breaker

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140681U (en) * 1983-03-09 1984-09-20 三和シヤツタ−工業株式会社 Internal shoji device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143320A (en) * 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
JPH0457696B2 (en) * 1981-02-28 1992-09-14 Mitsubishi Gas Chemical Co
JPS63251418A (en) * 1987-04-07 1988-10-18 Toshiba Chem Corp Curable composition
JPS63251417A (en) * 1987-04-07 1988-10-18 Toshiba Chem Corp Heat-resistant resin composition
JP2012116954A (en) * 2010-12-01 2012-06-21 Hitachi Cable Ltd Adhesive composition, adhesive film and wiring film using the same
CN102391810A (en) * 2011-09-19 2012-03-28 湖南神力铃胶粘剂制造有限公司 Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof
JP2017110135A (en) * 2015-12-17 2017-06-22 株式会社日立産機システム Mold varnish, resin cured product, power apparatus, and vacuum circuit breaker
WO2017104726A1 (en) * 2015-12-17 2017-06-22 株式会社日立産機システム Mold varnish, resin cured material, electric power apparatus, and vacuum circuit breaker

Also Published As

Publication number Publication date
JPS5817488B2 (en) 1983-04-07

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