JPS5430248A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS5430248A
JPS5430248A JP9664677A JP9664677A JPS5430248A JP S5430248 A JPS5430248 A JP S5430248A JP 9664677 A JP9664677 A JP 9664677A JP 9664677 A JP9664677 A JP 9664677A JP S5430248 A JPS5430248 A JP S5430248A
Authority
JP
Japan
Prior art keywords
resin composition
polyamide resin
polyamide
resin
dimensinal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9664677A
Other languages
Japanese (ja)
Other versions
JPS5521068B2 (en
Inventor
Takahiro Omura
Katsunori Miyoshi
Takafumi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Priority to JP9664677A priority Critical patent/JPS5430248A/en
Publication of JPS5430248A publication Critical patent/JPS5430248A/en
Publication of JPS5521068B2 publication Critical patent/JPS5521068B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: An epoxy acrylate resin is incorporated to a polyamide resin to produce said resin composition with high dimensinal stability and good coating properties without any adverse effect on the characteristics of polyamide.
COPYRIGHT: (C)1979,JPO&Japio
JP9664677A 1977-08-12 1977-08-12 Polyamide resin composition Granted JPS5430248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9664677A JPS5430248A (en) 1977-08-12 1977-08-12 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9664677A JPS5430248A (en) 1977-08-12 1977-08-12 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS5430248A true JPS5430248A (en) 1979-03-06
JPS5521068B2 JPS5521068B2 (en) 1980-06-06

Family

ID=14170584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9664677A Granted JPS5430248A (en) 1977-08-12 1977-08-12 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS5430248A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330569A (en) * 1986-07-24 1988-02-09 Nippon Paint Co Ltd Underwater curing epoxy paint composition
JPS63295615A (en) * 1987-05-28 1988-12-02 Teijin Ltd Polymerizable composition for molding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6392960B1 (en) 2017-09-12 2018-09-19 日機装株式会社 Nitride semiconductor light emitting device and method for manufacturing nitride semiconductor light emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330569A (en) * 1986-07-24 1988-02-09 Nippon Paint Co Ltd Underwater curing epoxy paint composition
JPH0521949B2 (en) * 1986-07-24 1993-03-26 Nippon Paint Co Ltd
JPS63295615A (en) * 1987-05-28 1988-12-02 Teijin Ltd Polymerizable composition for molding

Also Published As

Publication number Publication date
JPS5521068B2 (en) 1980-06-06

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