JPS53138943A - Etching method and apparatus - Google Patents

Etching method and apparatus

Info

Publication number
JPS53138943A
JPS53138943A JP5454577A JP5454577A JPS53138943A JP S53138943 A JPS53138943 A JP S53138943A JP 5454577 A JP5454577 A JP 5454577A JP 5454577 A JP5454577 A JP 5454577A JP S53138943 A JPS53138943 A JP S53138943A
Authority
JP
Japan
Prior art keywords
etching
etching method
amt
etched
substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5454577A
Other languages
Japanese (ja)
Inventor
Onori Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5454577A priority Critical patent/JPS53138943A/en
Publication of JPS53138943A publication Critical patent/JPS53138943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

PURPOSE:To control etching amt. with a high accuracy by introducing etching gas into an etching chamber to carry out etching; radiating light to substances to be etched; and detecting a change in reflected light.
JP5454577A 1977-05-11 1977-05-11 Etching method and apparatus Pending JPS53138943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5454577A JPS53138943A (en) 1977-05-11 1977-05-11 Etching method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5454577A JPS53138943A (en) 1977-05-11 1977-05-11 Etching method and apparatus

Publications (1)

Publication Number Publication Date
JPS53138943A true JPS53138943A (en) 1978-12-04

Family

ID=12973640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5454577A Pending JPS53138943A (en) 1977-05-11 1977-05-11 Etching method and apparatus

Country Status (1)

Country Link
JP (1) JPS53138943A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728334A (en) * 1980-07-28 1982-02-16 Fujitsu Ltd Etching method
JPS593925A (en) * 1982-06-29 1984-01-10 Ulvac Corp Dry etching control and end-point detection method
EP0119455A2 (en) * 1983-02-14 1984-09-26 Hitachi, Ltd. Etching method and apparatus
JPS59181537A (en) * 1983-03-31 1984-10-16 Fujitsu Ltd Etching method
JPS60253228A (en) * 1984-05-30 1985-12-13 Hitachi Ltd Monitoring of etching
JPS62271434A (en) * 1986-05-20 1987-11-25 Hitachi Ltd Detection of point of completion of etching
US5584933A (en) * 1993-08-31 1996-12-17 Sony Corporation Process for plasma deposition and plasma CVD apparatus
US5824158A (en) * 1993-06-30 1998-10-20 Kabushiki Kaisha Kobe Seiko Sho Chemical vapor deposition using inductively coupled plasma and system therefor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5728334A (en) * 1980-07-28 1982-02-16 Fujitsu Ltd Etching method
JPH0157494B2 (en) * 1980-07-28 1989-12-06 Fujitsu Ltd
JPS593925A (en) * 1982-06-29 1984-01-10 Ulvac Corp Dry etching control and end-point detection method
EP0119455A2 (en) * 1983-02-14 1984-09-26 Hitachi, Ltd. Etching method and apparatus
JPS59181537A (en) * 1983-03-31 1984-10-16 Fujitsu Ltd Etching method
JPH0343775B2 (en) * 1983-03-31 1991-07-03 Fujitsu Ltd
JPS60253228A (en) * 1984-05-30 1985-12-13 Hitachi Ltd Monitoring of etching
JPS62271434A (en) * 1986-05-20 1987-11-25 Hitachi Ltd Detection of point of completion of etching
US5824158A (en) * 1993-06-30 1998-10-20 Kabushiki Kaisha Kobe Seiko Sho Chemical vapor deposition using inductively coupled plasma and system therefor
US5584933A (en) * 1993-08-31 1996-12-17 Sony Corporation Process for plasma deposition and plasma CVD apparatus

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