JPS53123081A - Semiconductor wafer heat treatment apparatus - Google Patents

Semiconductor wafer heat treatment apparatus

Info

Publication number
JPS53123081A
JPS53123081A JP3774377A JP3774377A JPS53123081A JP S53123081 A JPS53123081 A JP S53123081A JP 3774377 A JP3774377 A JP 3774377A JP 3774377 A JP3774377 A JP 3774377A JP S53123081 A JPS53123081 A JP S53123081A
Authority
JP
Japan
Prior art keywords
heat treatment
treatment apparatus
semiconductor wafer
wafer heat
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3774377A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3774377A priority Critical patent/JPS53123081A/en
Publication of JPS53123081A publication Critical patent/JPS53123081A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the entry of the outside air into a furnace core tube and prevent the warpage of wafers by providing a hollow plate for gas blow-out near the portion connecting a gas inlet port and a boat of a draw-out bar which is used for putting semiconductor wafers into or out from a heat treatment apparatus and further providing one or more shield plates in adjacency thereto.
COPYRIGHT: (C)1978,JPO&Japio
JP3774377A 1977-04-01 1977-04-01 Semiconductor wafer heat treatment apparatus Pending JPS53123081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3774377A JPS53123081A (en) 1977-04-01 1977-04-01 Semiconductor wafer heat treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3774377A JPS53123081A (en) 1977-04-01 1977-04-01 Semiconductor wafer heat treatment apparatus

Publications (1)

Publication Number Publication Date
JPS53123081A true JPS53123081A (en) 1978-10-27

Family

ID=12505952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3774377A Pending JPS53123081A (en) 1977-04-01 1977-04-01 Semiconductor wafer heat treatment apparatus

Country Status (1)

Country Link
JP (1) JPS53123081A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636129A (en) * 1979-08-31 1981-04-09 Hitachi Ltd Method and device for heat treatment of semiconductor thin plate
JPS62293610A (en) * 1986-06-12 1987-12-21 Furukawa Electric Co Ltd:The Semiconductor thin film vapor growth equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636129A (en) * 1979-08-31 1981-04-09 Hitachi Ltd Method and device for heat treatment of semiconductor thin plate
JPS634343B2 (en) * 1979-08-31 1988-01-28 Hitachi Ltd
JPS62293610A (en) * 1986-06-12 1987-12-21 Furukawa Electric Co Ltd:The Semiconductor thin film vapor growth equipment

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