JPS5310272A - Ic unit of electronic watch - Google Patents

Ic unit of electronic watch

Info

Publication number
JPS5310272A
JPS5310272A JP8475676A JP8475676A JPS5310272A JP S5310272 A JPS5310272 A JP S5310272A JP 8475676 A JP8475676 A JP 8475676A JP 8475676 A JP8475676 A JP 8475676A JP S5310272 A JPS5310272 A JP S5310272A
Authority
JP
Japan
Prior art keywords
unit
electronic watch
isolate
pads
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8475676A
Other languages
Japanese (ja)
Inventor
Tadahiro Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP8475676A priority Critical patent/JPS5310272A/en
Publication of JPS5310272A publication Critical patent/JPS5310272A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE: To obtain an IC unit suitable for crystal oscillation type watches, etc. by molding the pads of the IC chip and a lead frame with resin, then connecting terminals using low melting point metal to isolate each terminal.
COPYRIGHT: (C)1978,JPO&Japio
JP8475676A 1976-07-16 1976-07-16 Ic unit of electronic watch Pending JPS5310272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8475676A JPS5310272A (en) 1976-07-16 1976-07-16 Ic unit of electronic watch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8475676A JPS5310272A (en) 1976-07-16 1976-07-16 Ic unit of electronic watch

Publications (1)

Publication Number Publication Date
JPS5310272A true JPS5310272A (en) 1978-01-30

Family

ID=13839518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8475676A Pending JPS5310272A (en) 1976-07-16 1976-07-16 Ic unit of electronic watch

Country Status (1)

Country Link
JP (1) JPS5310272A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
US5373190A (en) * 1991-08-12 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
US5373190A (en) * 1991-08-12 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

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