JPS5277587A - Wiring of integrated circuit outside chip - Google Patents

Wiring of integrated circuit outside chip

Info

Publication number
JPS5277587A
JPS5277587A JP15371675A JP15371675A JPS5277587A JP S5277587 A JPS5277587 A JP S5277587A JP 15371675 A JP15371675 A JP 15371675A JP 15371675 A JP15371675 A JP 15371675A JP S5277587 A JPS5277587 A JP S5277587A
Authority
JP
Japan
Prior art keywords
wiring
integrated circuit
circuit outside
outside chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15371675A
Other languages
Japanese (ja)
Inventor
Hiroo Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP15371675A priority Critical patent/JPS5277587A/en
Publication of JPS5277587A publication Critical patent/JPS5277587A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To increase reliability and certainty of wiring by bonding, via adhesive and conductive elastomer, pad part of convex shaped IC and lead terminal of substrate.
COPYRIGHT: (C)1977,JPO&Japio
JP15371675A 1975-12-23 1975-12-23 Wiring of integrated circuit outside chip Pending JPS5277587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15371675A JPS5277587A (en) 1975-12-23 1975-12-23 Wiring of integrated circuit outside chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15371675A JPS5277587A (en) 1975-12-23 1975-12-23 Wiring of integrated circuit outside chip

Publications (1)

Publication Number Publication Date
JPS5277587A true JPS5277587A (en) 1977-06-30

Family

ID=15568529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15371675A Pending JPS5277587A (en) 1975-12-23 1975-12-23 Wiring of integrated circuit outside chip

Country Status (1)

Country Link
JP (1) JPS5277587A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58153809U (en) * 1982-04-07 1983-10-14 株式会社モリタ製作所 Precision position control device
JPS61166534U (en) * 1985-04-02 1986-10-16
JPS63160351A (en) * 1986-12-24 1988-07-04 Seikosha Co Ltd Method for packaging ic chip
JPS63160348A (en) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ic chip
JPH03179756A (en) * 1990-11-02 1991-08-05 Seikosha Co Ltd Ic chip
JP2013105973A (en) * 2011-11-16 2013-05-30 Seiko Epson Corp Light-emitting device, method for manufacturing the same, and projector

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58153809U (en) * 1982-04-07 1983-10-14 株式会社モリタ製作所 Precision position control device
JPS61166534U (en) * 1985-04-02 1986-10-16
JPS63160351A (en) * 1986-12-24 1988-07-04 Seikosha Co Ltd Method for packaging ic chip
JPS63160348A (en) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ic chip
JPH0432540B2 (en) * 1986-12-24 1992-05-29
JPH0455530B2 (en) * 1986-12-24 1992-09-03 Seikosha Kk
JPH03179756A (en) * 1990-11-02 1991-08-05 Seikosha Co Ltd Ic chip
JP2013105973A (en) * 2011-11-16 2013-05-30 Seiko Epson Corp Light-emitting device, method for manufacturing the same, and projector

Similar Documents

Publication Publication Date Title
JPS5237721A (en) Semiconductor integrated circuit
SG82590A1 (en) Bumpless flip chip assembly with strips and via-fill
JPS5553446A (en) Container of electronic component
JPS5779652A (en) Resin-sealed semiconductor device
JPS5277587A (en) Wiring of integrated circuit outside chip
JPS5279773A (en) Bonding method of ic
JPS5210074A (en) Intergrated circuit device
EP0276940A3 (en) Semiconductor chip having external terminals connected to corresponding leads by wires
JPS5277684A (en) Exeternal wiring of integrated circuit
JPS5571052A (en) Substrate for semiconductor device
JPS5272572A (en) Semiconductor device
JPS5487173A (en) Semiconductor device
JPS54104286A (en) Integrated circuit device
JPS5353261A (en) Electronic device
JPS5348463A (en) Semiconductor integrated circuit support
JPS5267966A (en) Manufacture of semiconductor unit
JPS5290975A (en) Electronic wristwatch
JPS5265666A (en) Semiconductor device
JPS5360170A (en) Input/output pads of ic chip
JPS527676A (en) Semiconductor integrated circuit
JPS5240972A (en) Packaging construction of semiconductor device
JPS6464332A (en) Manufacture of tape carrier type semiconductor device
JPS52101971A (en) Semiconductor device
JPS5368163A (en) Production of flip chip
JPS5283166A (en) Semiconductor device and its production