JPS526974A - Multilayered circuit board and manufacturing it - Google Patents
Multilayered circuit board and manufacturing itInfo
- Publication number
- JPS526974A JPS526974A JP7880576A JP7880576A JPS526974A JP S526974 A JPS526974 A JP S526974A JP 7880576 A JP7880576 A JP 7880576A JP 7880576 A JP7880576 A JP 7880576A JP S526974 A JPS526974 A JP S526974A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- circuit board
- multilayered circuit
- multilayered
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59334175A | 1975-07-03 | 1975-07-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS526974A true JPS526974A (en) | 1977-01-19 |
Family
ID=24374344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7880576A Pending JPS526974A (en) | 1975-07-03 | 1976-07-02 | Multilayered circuit board and manufacturing it |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS526974A (en) |
CA (1) | CA1055164A (en) |
DE (1) | DE2629303C3 (en) |
FR (1) | FR2316833A1 (en) |
GB (1) | GB1535813A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766988B2 (en) * | 1984-12-28 | 1995-07-19 | エイ・ティ・アンド・ティ・コーポレーション | Microwave transition electronic device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3020196C2 (en) * | 1980-05-28 | 1982-05-06 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Multilevel printed circuit board and process for its manufacture |
US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
JPH0834340B2 (en) * | 1988-12-09 | 1996-03-29 | 日立化成工業株式会社 | Wiring board and manufacturing method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1919421C3 (en) * | 1969-04-17 | 1975-03-13 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Multilayer circuit board |
GB1310880A (en) * | 1969-06-13 | 1973-03-21 | Microponent Dev Ltd | Multi-layer printed circuit board assemblies |
DE2059425A1 (en) * | 1970-12-02 | 1972-06-22 | Siemens Ag | Partial structure of printed multilayer circuits |
-
1976
- 1976-06-18 GB GB2534476A patent/GB1535813A/en not_active Expired
- 1976-06-21 CA CA255,356A patent/CA1055164A/en not_active Expired
- 1976-06-30 DE DE19762629303 patent/DE2629303C3/en not_active Expired
- 1976-07-02 JP JP7880576A patent/JPS526974A/en active Pending
- 1976-07-02 FR FR7620215A patent/FR2316833A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766988B2 (en) * | 1984-12-28 | 1995-07-19 | エイ・ティ・アンド・ティ・コーポレーション | Microwave transition electronic device |
Also Published As
Publication number | Publication date |
---|---|
FR2316833B1 (en) | 1982-01-29 |
FR2316833A1 (en) | 1977-01-28 |
DE2629303C3 (en) | 1981-03-26 |
CA1055164A (en) | 1979-05-22 |
GB1535813A (en) | 1978-12-13 |
DE2629303B2 (en) | 1980-07-17 |
DE2629303A1 (en) | 1977-01-20 |
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